A three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform

Abstract

The invention discloses a three-degree-of-freedom supersonic vibration auxiliary machining and precise positioning platform. An electrospark wire-electrode cutting technology is used for processing, and assembling on machinery is reduced; four symmetric flexible differential amplifying mechanisms are connected in parallel, therefore, high-precision translation of a moving platform in an XY plane is realized, and translation of series bridge type amplifying mechanisms in a Z direction is realized; a large platform is serially connected with a small platform, and in-plane ultrasonic vibration isprovided by a high-frequency piezoelectric ceramic piece; the precise positioning platform is compact in structure, and can have high inherent frequency; and by the symmetric flexible mechanisms, coupling errors caused by mechanism transmission can be eliminated; the differential amplifying mechanisms and the bridge type amplifying mechanisms have large displacement amplifying ratio, and thus, the moving platform has large travel when translating in the X direction, the Y direction and the Z direction; and by four parallel sheet flexible hinge mechanisms connected with the bridge type mechanisms, decoupling of the precise positioning platform to X-direction translation and Y-direction translation of the moving platform can be realized, and the moving precision of the moving platform is improved.

Description

technical field [0001] The invention relates to the field of micro-nano manufacturing, in particular to a three-degree-of-freedom ultrasonic vibration-assisted machining precision positioning platform. Background technique [0002] With the development of science and technology, micro-nano technology has developed rapidly, and the demand for complex micro-nano structures with nanometer precision is becoming more and more extensive. In order to obtain higher processing speed and processing accuracy, ultrasonic vibration is applied to micro-nano processing In the process, there are currently few ultrasonic vibration-assisted processing platforms, especially ultrasonic vibration micro-motion platforms with three-degree-of-freedom motion performance. At present, most ultrasonic vibration-assisted processing platforms have small strokes and cannot realize three-dimensional processing, which cannot meet the processing requirements. Contents of the invention [0003] The purpose...

AI Technical Summary

Problems solved by technology

[0002] With the development of science and technology, micro-nano technology has developed rapidly, and the demand for complex micro-nano structures with nanometer precision is becoming more and more extensive. In order to obtain higher processing speed and processing accuracy, ultrasonic vibration is applied to micro-nano processing In the process, there are currently few ultrasonic vibration-assisted processing platforms, especially ultrasonic vibration micro-motion platforms with three-degree-of-freedom motion performance

At present, most ultrasonic vibration-assisted processing platforms have a small stroke and cannot realize three-dimensional processing, which cannot meet the processing requirements

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