Shell and preparation method, electronic device
A shell and ceramic technology, which is applied in the field of electronic equipment component preparation, shell and preparation, and can solve the problems that electronic equipment needs to be improved.
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[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0022] In one aspect of the invention, the invention proposes a casing. According to an embodiment of the present invention, refer to figure 1 as well as figure 2 , the casing 100 includes: a plurality of laminated ceramic sub-layers 110 (such as figure 2 shown), in a plurality of ceramic sub-layers 110, two adjacent ceramic sub-layers, for example, ceramic sub-layer 110A and ceramic sub-layer 110B have different colors, and the outer surface of the housing includes at least two different colors The ceramic sublayer 110, such as fi...
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