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Method for in situ measurement of Young's modulus of mems microbeam materials

A technique of Young's modulus and in-situ measurement, applied in the field of micro-electromechanical systems, which can solve problems such as damaged samples

Active Publication Date: 2020-07-10
CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
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Problems solved by technology

[0004] Based on this, in view of the current measurement methods of MEMS microbeam material Young's modulus all require specially designed samples of specific size and may damage the sample, it is necessary to provide a Young's modulus for in-situ measurement of MEMS microbeam material Quantitative method, which can realize high-precision non-destructive in-situ measurement of Young's modulus in MEMS

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  • Method for in situ measurement of Young's modulus of mems microbeam materials

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[0038] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of descr...

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Abstract

The invention relates to a method for performing in-situ measurement on Young's modulus of an MEMS microbeam material. The method for performing in-situ measurement on the Young's modulus of the MEMSmicrobeam material provided by the invention includes the following steps: obtaining a structural parameter, a pull-in voltage, a first natural frequency and a mode shape function of an MEMS microbeam; determining a first estimated value of the gap distance according to the structural parameter, the pull-in voltage, the first natural frequency and the mode shape function; obtaining a second heightand a second natural frequency of the MEMS microbeam after applying a bias voltage; determining a second estimated value of the gap distance according to the structural parameter, the pull-in voltage, the bias voltage, the second height, the second natural frequency, the mode shape function and the first estimated value; and determining the Young's modulus of the MEMS microbeam according to the structural parameter, the mode shape function, the second estimated value, the second height and the pull-in voltage or the first natural frequency of the MEMS microbeam. According to the above method,the Young's modulus of the microbeam material can be measured in the case that the thickness of the microbeam is unknown, and thus the high-accuracy non-destructive in-situ measurement of the Young'smodulus can be achieved.

Description

technical field [0001] The invention relates to the field of microelectromechanical systems, and more particularly to a method for in-situ measurement of the Young's modulus of MEMS microbeam materials. Background technique [0002] In the field of MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System), a large number of micro-sensors and micro-actuators adopt micro-beam structures, and the elastic characteristics of micro-beam structures affect and even determine the performance and life of micro-sensors and micro-actuators. , reliability and stability. The measurement of Young's modulus of MEMS microbeam material is the key to evaluate the elastic properties of MEMS microbeam structure. Since the elastic properties of MEMS microbeam materials are greatly affected by the manufacturing process, it is more and more important to measure the Young's modulus of MEMS microbeam materials in situ. [0003] At present, for the measurement of the Young's modulus of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01M5/00G01B11/02G01B11/06
CPCG01B11/02G01B11/06G01M5/005
Inventor 朱军华黄钦文董显山恩云飞刘人怀
Owner CHINA ELECTRONICS PROD RELIABILITY & ENVIRONMENTAL TESTING RES INST
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