Semiconductor memory device (200, 400, 700) comprising: a matrix (202, 800) of memory cells (204, 302, 804, 814, 816) arranged in a plurality of rows and columns (300), each
memory cell (204, 302, 814, 816) having a plurality of
bit cell transistors (308); and a plurality (802) of write assist circuits (100, 206, 208, 510, 808) comprising one or more write assist circuits (100, 206, 208, 510, 808) in each column (300) of the matrix (202, 800) of memory cells (204, 302, 804, 814, 816), wherein each write assist circuit (100, 206, 208, 808) is configured to provide a core
voltage (VDDAI, 112, 210) for memory cells (204, 302, 804, 814, 816) in the same column (300) and to lower the core
voltage (VDDAI, 112, 210) during a write operation, and wherein the one or more Write assistant circuits (100, 206, 208, 510, 808) comprising: a first pair of transistors (102, 104) connected between a pull-up
voltage (VDD, 110) and a core voltage
bus (VDDAI, 112, 210), the first pair of transistors (102, 104) being configured to connect the core voltage
bus (VDDAI, 112, 210) to the pull-up voltage (VDD, 110) during the write operation; and a second pair of transistors (106, 108) connected between a pull-down voltage (VSS, 116) and the core voltage
bus (VDDAI, 112, 210), the second pair of transistors (106, 108) each having a gate terminal receiving an enable
signal (LCV_Enb, 118, 214, 518) that causes the second pair of transistors (106, 108) to connect the core voltage bus (VDDAI, 112, 210) to the pull-down voltage (VSS, 116) during the write operation;wherein the matrix (202, 800) of memory cells (204, 302, 804, 814, 816) and the plurality (802) of write assist circuits (100, 206, 208, 510, 808) have a common
semiconductor layout (400, 700) having a repeating structure of gate regions and active regions, wherein each of the plurality (802) of write assist circuits (100, 206, 208, 510, 808) uses a
layout area (808) of the common
semiconductor layout (400, 700) that corresponds to an area for three adjacent memory cells (204, 302, 804, 814, 816) in a column (300) of the matrix (202, 800) of memory cells (204, 302, 804, 814, 816) corresponds.;