Processing technology of surface acoustic filter, and surface acoustic filter
A technology of surface acoustic filter and processing technology, applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of high price and difficult to reduce the cost of surface acoustic filter, so as to improve production efficiency and reduce spraying flux. As well as the work of flux cleaning, the effect of reducing production costs
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Embodiment 1
[0034] Such as figure 1 As shown, the present embodiment provides a surface acoustic filter processing technology, in which chips are installed on the substrate in a flip-chip manner, and solder balls are used as soldering materials in the flip-chip process, and the The tin balls are soldered to the substrate.
[0035] Compared with the traditional use of gold as the soldering material, the use of tin balls as the soldering material can greatly reduce the material cost of the surface acoustic filter, while ensuring that the performance will not be affected, and the welding through the laser thermal bonding process can make the temperature at 10 The high temperature reaches 260°C in nanoseconds. Such a high-speed welding process leads to the completion of soldering without oxidation of the solder balls. Therefore, soldering can be achieved without using flux, and the work of spraying flux and flux cleaning is reduced in the process. , simplify the process, improve production e...
Embodiment 2
[0045] Such as figure 1 As shown, the present embodiment provides a surface acoustic filter processing technology, in which chips are installed on the substrate in a flip-chip manner, and solder balls are used as soldering materials in the flip-chip process, and the The tin balls are soldered to the substrate. The solder balls are connected to the chip by laser thermal bonding.
[0046] Specifically, the surface acoustic filter processing technology described in this embodiment includes the following steps:
[0047] Step S1, providing a chip, providing a chip with a functional area;
[0048] Step S2, planting balls, planting solder balls on the chip, and welding the solder balls to the chip by means of laser thermal bonding;
[0049]Step S3, providing a substrate, providing a substrate with a circuit pattern, and the substrate has a chip mounting area;
[0050] Step S4, soldering the chip, mounting the chip on the chip mounting area in a flip-chip manner, and soldering and...
Embodiment 3
[0054] Such as figure 1 , 2 , 2A, the present embodiment provides a surface acoustic filter processing technology, the chip 100 is arranged on the substrate 200 in a flip-chip manner, and the solder ball 400 is used as the soldering material in the flip-chip process, and the laser thermal bonding The solder ball 400 is connected to the substrate 200 by soldering.
[0055] Preferably, the solder balls 400 are connected to the chip 100 by laser thermal bonding.
[0056] The processing technology of the surface acoustic filter specifically includes the following steps:
[0057] Step S1, providing a chip 100, providing a chip 100 with a functional area;
[0058] Step S2, planting balls, planting solder balls 400 on the chip 100, and welding the solder balls 400 to the chip 100 by means of laser thermal bonding;
[0059] Step S3, providing a substrate 200, providing a substrate 200 with a circuit pattern, and the substrate 200 has a mounting area for the chip 100;
[0060] Ste...
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