Mold device and resin parts
A resin and mold technology, applied in vehicle parts, signal devices, transportation and packaging, etc., can solve problems such as poor molding, diffusion of molten resin, etc., and achieve the effect of reducing poor molding
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[0026] Hereinafter, the present invention will be described based on preferred embodiments with reference to the drawings. The embodiments are not intended to limit the invention but are examples, and all the features and combinations thereof described in the embodiments are not necessarily limited to the essence of the invention. The same or equivalent structural elements, components, and processes shown in the drawings are given the same reference numerals, and overlapping descriptions are appropriately omitted. In addition, the scale and the shape of each part shown in each drawing are set conveniently for the sake of easy description, and are not limitedly interpreted unless otherwise mentioned. In addition, even if it is the same member, there may be slight differences in scale and the like between the drawings. In addition, when terms such as "first" and "second" are used in this specification or technical solutions, unless otherwise specified, they are not terms indica...
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