Chip heat exchanger and variable frequency air conditioner
A heat exchanger and chip technology, applied in indirect heat exchangers, air-conditioning systems, instruments, etc., can solve problems such as reduced heat dissipation power, slow cooling frequency increase, and insufficient cooling capacity, so as to promote cycle power improvement and reduce operation Temperature, the effect of improving the cooling effect
Active Publication Date: 2019-08-23
QINGDAO HAIER AIR CONDITIONER GENERAL CORP LTD +1
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Problems solved by technology
[0002] At present, under the high temperature environment in summer, the chip of the computer board of the inverter air conditioner has poor heat dissipation, which leads to slow and difficult frequency increase of cooling, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users
T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) become smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and the hardware failure is caused.
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[0025] The following description and drawings illustrate specific embodiments of the invention sufficiently to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present invention includes the full scope of the claims, and all available equivalents of the claims. Herein, various embodiments may be referred to individually or collectively by the term "invention", which is for convenience only and is not intended to automatically limit the scope of this application if in fact more than one invention is disclosed. A single invention or inventive concept. Herein, relational terms such...
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The invention discloses a chip heat exchanger and a variable frequency air conditioner, and belongs to the field of chip heat dissipation. The chip heat exchanger comprises a heat pipe, and further comprises a huffing plate condenser and a capillary pipe; an evaporation section of the heat pipe is arranged under a chip of an air conditioner computer board; a condensation section of the heat pipe is connected with the evaporation section through the capillary pipe; and the condensation section is connected with the huffing plate condenser. The increment of circulating power of refrigerants andthe increment of the heat absorbing quantity of the evaporation section are accelerated; the chip operation temperature is lowered; and the problems of slow and difficult refrigeration frequency increment caused by bad heat dissipation of the chip of the variable frequency air conditioner computer board under high-temperature environment in summer, easy wrong report of control logic, and user complaint caused by insufficient refrigerating capacity and high operation power consumption are solved.
Description
technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and an inverter air conditioner. Background technique [0002] At present, under the high temperature environment in summer, the chip of the inverter air conditioner computer board has poor heat dissipation, which leads to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users. T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) When the temperature becomes smaller, the heat dissipation power becomes smaller, and even computer boards are burned, the system goes down, and hardware failures occur. Contents of the invention [0003] The embodimen...
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IPC IPC(8): F28D15/04F24F1/24G06F1/20
CPCF24F1/24F28D15/04G06F1/20Y02D10/00
Inventor董旭王飞王定远徐佳罗荣邦
OwnerQINGDAO HAIER AIR CONDITIONER GENERAL CORP LTD