Chip heat exchanger and inverter air conditioner

Abstract

The invention discloses a chip heat exchanger and an inverter air conditioner, which belong to the technical field of chip heat dissipation. The chip heat exchanger includes a heat pipe, and further includes: an expansion plate condenser and a capillary tube; the evaporation section of the heat pipe is arranged in the air conditioner The condensing section of the heat pipe is connected to the evaporating section through the capillary, and the condensing section is connected to the expansion plate condenser, and the expansion plate condenser is connected to the It is bent and arranged below the plane where the evaporation section is located. In this solution, the expansion plate condenser is bent and arranged below the plane where the evaporating section is located, and coincides with the direction of the fan bracket in the outdoor unit of the air conditioner, which does not block the air volume and wind speed of the fan, and can also promote the cooling of the refrigerant in the expansion plate by means of the air volume Condensation heat dissipation improves heat exchange efficiency, reduces chip operating temperature, and solves the problem of slow and difficult cooling frequency increase due to poor heat dissipation of the chip on the computer board of the inverter air conditioner in the high temperature environment in summer, and the control logic is prone to error reporting.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation, in particular to a chip heat exchanger and an inverter air conditioner. Background technique [0002] At present, under the high temperature environment in summer, the chip of the inverter air conditioner computer board has poor heat dissipation, which leads to slow and difficult cooling frequency increase, error-prone control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users. T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) When the temperature becomes smaller, the heat dissipation power becomes smaller, and even computer boards are burned, the system goes down, and hardware failures occur. Contents of the invention [0003] The embodimen...

AI Technical Summary

Problems solved by technology

[0002] At present, under the high temperature environment in summer, the chip of the computer board of the inverter air conditioner has poor heat dissipation, which leads to slow and difficult frequency increase of cooling, easy error reporting of control logic, insufficient cooling capacity, and high power consumption during operation, causing complaints from users

T3 working condition (53°C) or higher ambient temperature, air temperature around the inverter chip +10°C (63°C), difference between the heat source temperature of the computer board (68-120°C) and the ambient temperature (5-57°C) become smaller, the heat dissipation power becomes smaller, and even the computer board is burned, the system is down, and the hardware failure is caused.

Images