Housing and electronic equipment

Abstract

The present application provides a casing and an electronic device, the casing includes a middle frame, a heat conduction element and a protection element. Wherein, the middle frame is provided with a first storage area, and the first storage area is used for storing electronic components of electronic equipment; the middle frame is also provided with a storage groove, and the storage groove runs through the middle frame and communicates with the first storage area. The heat conduction element is accommodated in the accommodation groove, and the protection element is at least partially accommodated in the accommodation groove, and is arranged on a side of the heat conduction element facing the first accommodation area. In this application, the protective member is opposite to or in contact with the electronic components arranged in the first storage area, and then, the heat emitted by the first electronic component is transferred to other positions of the electronic equipment through the protective member and the heat conducting member, and then dissipated to realize electronic protection. The uniform heat of the equipment can avoid local overheating of the electronic equipment and improve the heat dissipation efficiency of the electronic equipment. At the same time, by providing the protective member, it is possible to prevent the heat conduction member from causing damage to the battery when misalignment occurs, thereby improving the reliability of the electronic device.

Description

technical field [0001] The present application relates to the field of consumer electronic equipment, in particular to a casing and electronic equipment. Background technique [0002] With the development of existing electronic device technology, more and more electronic devices have entered people's daily life. As the performance and functions of electronic devices such as mobile phones and tablets are getting higher and higher, the heating problem of these electronic devices is also becoming more and more serious. [0003] The heat dissipation method of traditional electronic equipment is mainly by adding heat dissipation materials with good thermal conductivity such as graphite or copper foil inside the electronic equipment. The temperature is lowered. However, since different electronic components are located in different parts, it is easy to cause heat concentration of electronic equipment, and the heat concentrated at each point cannot be dissipated in time by arrang...

AI Technical Summary

Problems solved by technology

However, since different electronic components are located in different parts, it is easy to cause heat concentration of electronic equipment, and the heat concentrated at each point cannot be dissipated in time by arranging heat dissipation materials such as graphite or copper foil, and the heat dissipation effect of electronic equipment is not good.

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