A flexible microneedle patch for transdermal drug delivery and its manufacturing method

A technology of transdermal drug delivery and microneedle sticking, which is applied in the field of biomedicine, can solve the problems of cumbersome process and high cost, and achieve the effect of high efficiency, low cost and high precision

Active Publication Date: 2021-03-16
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Through the research of the inventors of the present disclosure, it is found that these methods are complex and costly

Method used

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  • A flexible microneedle patch for transdermal drug delivery and its manufacturing method
  • A flexible microneedle patch for transdermal drug delivery and its manufacturing method
  • A flexible microneedle patch for transdermal drug delivery and its manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A flexible microneedle patch for transdermal drug delivery, such as Figure 1~2 As shown, it includes a flexible film substrate PMMA 110, a microneedle structure layer 120 and a drug delivery layer 130, the microneedle structure layer 120 is on the surface of the flexible film substrate layer 110, and the microneedle structure layer 120 is an array formed by several tapered structures , the surface of each cone-shaped structure is provided with a pit structure, and the drug delivery layer 130 is arranged on the surface of each cone-shaped structure.

[0043] The diameter of the base of the cone-shaped structures is 200 μm, the height is 600 μm, the distance between the cone-shaped structures is 150 μm, and the cone-shaped structures are arranged in a rectangular array. The pit structure on the surface of the tapered structure is hemispherical, with a diameter of 10 μm and a depth of 5 μm.

[0044] Its preparation method, such as image 3 As shown, the size of the tape...

Embodiment 2

[0047] This embodiment is the same as Embodiment 1, except that the diameter of the pit structure on the surface of the tapered structure is 50 μm.

Embodiment 3

[0049] This embodiment is the same as Embodiment 1, except that the diameter of the pit structure on the surface of the tapered structure is 100 μm.

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PUM

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Abstract

The disclosure provides a flexible microneedle patch for transdermal drug delivery and a manufacturing method thereof. The flexible microneedle patch includes a flexible film substrate layer, a microneedle structure layer and a drug delivery layer. On the surface of the film substrate layer, the microneedle structure layer is an array formed by several cone structures, each cone structure surface has a pit structure, and the drug delivery layer is arranged on the surface of each cone structure. The flexible microneedle patch provided by the present disclosure has the advantages of low cost, mass production, precise control of drug carrying amount and release time, and the like.

Description

technical field [0001] The disclosure belongs to the technical field of biomedicine, and relates to a flexible microneedle patch for transdermal drug delivery and a manufacturing method thereof. Background technique [0002] The statements herein merely provide background information related to the present disclosure and may not necessarily constitute prior art. [0003] For protein or polypeptide drugs such as insulin, injections are traditionally used. This method requires frequent injections, which will cause great physical damage to the patient and increase the psychological burden on the patient. With the development of medical technology, transdermal drug delivery technology has been greatly developed, of which microneedle patch technology is the representative. According to the knowledge of the inventors of the present disclosure, the existing microneedle patch technology has high cost, is difficult to manufacture in batches, and it is difficult to accurately control...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00
CPCA61M37/0015A61M2037/0023A61M2037/0053A61M2037/0046
Inventor 张成鹏姜兆亮刘文平马嵩华
Owner SHANDONG UNIV
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