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Probe inspection system and method for detecting semiconductor element

A probe detection, semiconductor technology, used in the testing of single semiconductor devices, components of electrical measuring instruments, measuring electricity, etc., can solve scratches, can not provide good resistance to external vibration and drift of cantilever probes, electrical contact Stability impact, etc.

Active Publication Date: 2019-09-27
KLA TENCOR TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In addition to the problem that the tip of the cantilever probe will cause scratches on the surface of the semiconductor component, the existing inspection system cannot provide a good resistance of the cantilever probe to external vibration and drift, thus making the cantilever probe in the inspection of semiconductor components. The stability of the electrical contact of the element is affected when the

Method used

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  • Probe inspection system and method for detecting semiconductor element
  • Probe inspection system and method for detecting semiconductor element
  • Probe inspection system and method for detecting semiconductor element

Examples

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Embodiment Construction

[0029] The disclosed embodiments provide many different embodiments or examples for implementing different features of the disclosed embodiments. Specific examples of components and arrangements are described below to simplify embodiments of the present disclosure. Of course, these are examples only and are not meant to be limiting. For example, in the following description, forming a first feature over or on a second feature may include embodiments of the first feature and the second feature forming direct contact, and may also include additional Embodiments in which a feature may be formed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact. In addition, the embodiments of the present disclosure may repeat reference symbols and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configu...

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PUM

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Abstract

Embodiments of the present disclosure relate to a probe inspection system and a method for detecting a semiconductor element. The probe inspection system according to an embodiment includes: a probe; a probe support member configured to support the probe; a probe adjustment member configured to connect to the probe support member; a bracket having a first end and a second end and configured to allow the first end to pivotally couple to the probe adjustment member, wherein the first end includes a first hole that receives a first pivot; a slider configured to be pivotally coupled to the second end of the bracket; and a motor configured to linearly move the slider in the length direction of the motor. The probe detection system and the method for detecting the semiconductor element provided by the embodiment of the invention can enable the probe to rotationally approach to, to be in contact with and to depart from the surface of the semiconductor element, and avoid any damaging to the surface of the semiconductor element while achieving the stable detection of performances of the semiconductor element.

Description

technical field [0001] The present disclosure generally relates to systems and methods for inspecting electrical properties of semiconductor devices, and more particularly, to systems and methods for inspecting electrical properties of semiconductor devices using probes. Background technique [0002] In the prior art, the cantilever probe can be used to detect the sheet resistance or other electrical properties of the semiconductor element, and the cantilever probe is positioned to form a certain angle with the surface of the semiconductor element along its length direction, such as but not limited to, about 30 degrees. It is necessary to operate the cantilever probe to make a vertical movement in a direction perpendicular to the surface of the semiconductor component to make electrical contact between the cantilever probe and the surface of the semiconductor component, thereby passing current through the semiconductor component. After the cantilever probe touches the surfa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26G01R1/073
CPCG01R31/2601G01R1/073
Inventor 董兰生张卓贤朱南昌游海洋
Owner KLA TENCOR TECH CORP