Plastic uptake processing equipment

Abstract

The invention discloses plastic uptake processing equipment which comprises a plastic extruding mechanism, a plastic cutting mechanism, a plastic uptake mould assembly and a heating assembly. The heating assembly is arranged below an upper fixing frame. The upper fixing frame is fixed to a lower fixing frame. A hole for the plastic uptake mould assembly to penetrate is formed in the center position of the lower fixing frame. A second drive air cylinder is arranged below the plastic uptake mould assembly. The plastic uptake mould assembly comprises a plastic uptake mould and a mould sleeve. Themould sleeve is provided with a mould groove. A third drive air cylinder is arranged on the bottom of the mould groove. The plastic uptake mould is arranged in the mould groove and fixed to the thirddrive air cylinder. An adsorption hole is formed in the upper surface of the plastic uptake mould. The equipment ensures that after the plastic sheets are heated, plastic uptake is carried out without being influenced by environment, the plastic uptake effect is ensured, meanwhile, no air exists on the plastic sheets obtained after plastic uptake and the surface of the plastic uptake mould, the shape of formed uptake plastic is complete, and no air bubbles appear.

Description

technical field [0001] The invention belongs to the technical field of plastic blister processing, and in particular relates to plastic blister processing equipment. Background technique [0002] Blister processing is to heat the flat hard plastic sheet to soften it, then use vacuum to absorb it on the surface of the mold, and then shape it after cooling. Blister products are widely used, involving various industries such as electronics, electrical appliances, food, hardware tools, cosmetics, toys, daily necessities, medicine, health care products, automobiles, stationery, stationery, and sports goods. [0003] However, there are still some deficiencies in the existing blister processing devices. For example, when the heated plastic is put into the mold, it will be affected by the ambient temperature, and if the blister molding is not timely, it will cause the plastic to be difficult to form; some molds The adsorption holes on the surface have poor adsorption capacity and u...

AI Technical Summary

Problems solved by technology

[0003] However, there are still some deficiencies in the existing blister processing devices. For example, when the heated plastic is put into the mold, it will be affected by the ambient temperature, and if the blister molding is not timely, it will cause the plastic to be difficult to form; some molds The adsorption holes on the surface have poor adsorption capacity and uneven adsorption, resulting in gaps between the plastic and the mold during adsorption, making the molded plastic unable to achieve the desired shape

Images