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Clearing out method, revealing device, lithographic apparatus, and device manufacturing method

A technology for lithography equipment and determination devices, which is applied in the fields of semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., and can solve problems such as time-consuming, yield loss, and consumption of machine capacity.

Pending Publication Date: 2020-02-21
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These additional processing steps are time consuming and consume significant machine capacity and can result in yield loss

Method used

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  • Clearing out method, revealing device, lithographic apparatus, and device manufacturing method
  • Clearing out method, revealing device, lithographic apparatus, and device manufacturing method
  • Clearing out method, revealing device, lithographic apparatus, and device manufacturing method

Examples

Experimental program
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Embodiment Construction

[0055] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically depicted. The equipment includes:

[0056] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation or EUV radiation);

[0057] - a support structure (eg mask table) MT configured to support a patterning device (eg mask) MA and connected to a first positioner PM configured to accurately position the patterning device according to certain parameters;

[0058] - a substrate table (e.g., wafer table) WTa or WTb configured to hold a substrate (e.g., a resist-coated wafer) W and configured to accurately position the substrate according to certain parameters in a second positioner device PW connected; and

[0059] - A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C of the substrate W (eg comprising one or...

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PUM

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Abstract

The invention relates to a method for revealing sensor targets on a substrate covered with a layer, said method comprising the following steps: determining locations of first areas on the substrate with yielding target portions and of second areas on the substrate with non-yielding target portions; at least partially removing feature regions of the layer covering sensor targets in the second areasto reveal sensor targets in the second areas; measuring a location of the revealed sensor targets in the second areas; determining a location of sensor targets in the first areas based on the measured location of the revealed sensor targets in the second areas; and at least partially removing sensor target regions of the layer covering the sensor targets in the first areas using the determined location of the sensor targets in the first areas.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from European application 17179804.4 filed on 05.07.2017, which is hereby incorporated by reference in its entirety. technical field [0003] The invention relates to a method for revealing a sensor target on a substrate, a corresponding revealing device, a lithographic apparatus comprising such a revealing device, and a device manufacturing method. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually on a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern may be transferred onto a target portion (eg, including a portion of a die, one or more dies) on...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00H01L23/544
CPCG03F9/7084H01L23/544H01L2223/54426H01L21/31122H01L22/20
Inventor A·B·珍宁科V·沃罗尼纳T·朱兹海妮娜B·彼得森J·A·C·M·皮耶宁堡
Owner ASML NETHERLANDS BV