Mildew-proof wallpaper

A technology for anti-mildew and wallpaper, applied in covering/lining, construction, building construction, etc., can solve the problems of lowering people's quality of life, lack of air permeability, mildew on walls, etc., and achieve good softness and comfort, Anti-mildew, high cushioning effect

Inactive Publication Date: 2020-03-17
丁细生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the wallpaper in the prior art lacks good air permeability when it has good water resistance, and it is easy to cause mildew on the wall and reduce people's quality of life.

Method used

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  • Mildew-proof wallpaper

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Effect test

Embodiment Construction

[0011] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0012] refer to figure 1 , the embodiment of the present invention discloses that a kind of anti-mildew wallpaper comprises a decorative surface layer 1, a first buffer resin layer 2, a waterproof layer 3, a second buffer resin layer 4 and a wallpaper base material which are stacked sequentially from top to bottom Layer 5. In this embodiment, the wallpaper base material layer 5 adopts a polypropylene silk fiber layer with ultra-low water absorption and excellent air permeability. In this embodiment, the thickness of the decorative surface layer 1 is 0.8mm, and the actual production Among them, as long as the thickness of the decorative surface layer 1 is between 0.5-1.3, the purpose of the present invention can be implemented. On the first buffer resin layer 2, there are a plurality of first air channels 6 that communicate with each other. The secon...

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Abstract

The invention relates to a mildew-proof wallpaper. The mildew-proof wallpaper comprises a decorative surface layer, a first buffer resin layer, a waterproof layer, a second buffer resin layer and a wallpaper substrate layer which are sequentially stacked from top to bottom, wherein a plurality of first airflow channels mutually communicating with each other are arranged on the first buffer resin layer, a plurality of second airflow channels mutually communicating with each other are arranged on the second buffer resin layer in a matched manner, and a plurality of air ventilation holes which are used for connecting the first airflow channels and the second airflow channels are also arranged on the waterproof layer. According to the mildew-proof wallpaper, through the structural design of the airflow channel formed by the first airflow channels, the air ventilation holes and the second airflow channels, a plurality of airflow channels for realizing internal and external through flow guidance are formed in the wallpaper, the wallpaper can realize good airflow circulation between the wall surface and the external environment while keeping good water resistance, the evaporation of the wall surface liquid is accelerated, and the mildew is avoided.

Description

technical field [0001] The invention relates to the field of wall decoration, in particular to an anti-mildew wallpaper. Background technique [0002] Wallpaper, also known as wallpaper, English is Wallpaper or Wallpaper, it is a widely used interior decoration material. Because wallpaper has the characteristics of various colors, rich patterns, luxurious style, safety and environmental protection, convenient construction, and reasonable price, which are incomparable to many other interior decoration materials, it has been widely popularized in developed countries and regions such as Europe, America, Southeast Asia, and Japan. . Wallpaper is divided into many categories, such as coated wallpaper, laminated wallpaper, embossed wallpaper and so on. Usually bleached chemical wood pulp is used to produce base paper, and then processed by different processes, such as coating, printing, embossing or surface coating, and finally cut and packaged before leaving the factory, becaus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F13/00E04F13/075
CPCE04F13/002E04F13/007E04F13/0866E04F13/0875
Inventor 丁细生刘二玲
Owner 丁细生
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