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Bonding device and bonding method

A lamination device and lamination technology, applied in the direction of lamination device, chemical instrument and method, telephone structure, etc., can solve problems such as poor lamination and lamination of air bubbles, achieve uniform lamination pressure and avoid uneven pressure , the effect of reducing the risk of air bubbles

Active Publication Date: 2022-02-22
KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at at least solving the technical problems existing in the prior art, and proposes a bonding device and a bonding method, which solve the problems of bonding bubbles and poor bonding in the prior art

Method used

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  • Bonding device and bonding method
  • Bonding device and bonding method

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Embodiment Construction

[0025] The characteristics and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only configured to explain the present invention, not to limit the present invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention.

[0026] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation...

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Abstract

The present application discloses a laminating device for laminating a flexible panel and a curved cover. The laminating device includes: a first jig for fixing the curved cover; a second jig for the curved cover; The first jig is arranged oppositely, the second jig includes an elastic curved surface, the shape of the elastic curved surface matches the shape of the curved surface cover plate, and the elastic curved surface is used to fit and fix the flexible panel; The second jig includes rolling rollers, and the elastic curved surface is in contact with the rolling rollers so as to produce elastic deformation under the extrusion of the rolling rollers, so that the flexible panel and the curved cover plate are attached and fixed. This application reduces the risk of air bubbles at the rounded corners of the curved cover by sequentially contacting and bonding the flexible panel and the curved cover; in addition, since the bonding method of the flexible panel and the curved cover is line The contact ensures uniform bonding pressure and avoids the problem of uneven pressure of traditional silicone PAD (fixture) bonding.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a bonding device and a bonding method. Background technique [0002] With the rapid development of full-screen displays, 3D and 4D curved displays have gradually become the main form of mobile phones. The current 3D curved cover has a bending angle of only 30°-40°, but with the further improvement of technology, right-angled or larger The angled 3D curved cover also came into being, gradually realizing the purpose of canceling the physical buttons on the side of the existing mobile phone. [0003] Traditionally, the lamination method of the flexible panel and the curved cover is to use the vertical feeding method to make the flexible panel and the side of the curved cover contact in advance, which may easily cause the edge of the flexible panel and the curved cover to contact in advance, resulting in Defects of edge cracking and bubble generation, uneven pressure in each bondin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10H04M1/02
CPCB32B37/10H04M1/026
Inventor 刘苏伟杨硕古春笑袁亚鸿
Owner KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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