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A kind of organosilicon modified polyurethane conductive adhesive

A technology of silicone and conductive adhesive, applied in the field of conductive adhesive, can solve the problems of low weather resistance, high hardness, large stress, etc.

Active Publication Date: 2022-01-14
芯嵛半导体(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Conductive adhesive can be divided into epoxy resin system, acrylate resin system, silicone resin system, polyurethane resin system, etc. according to the matrix. The epoxy system has high bonding strength, high hardness and large stress; the acrylic system has high bonding strength and heat resistance. , poor weather resistance; silicone system, good weather resistance, low stress, environmentally friendly, but relatively low bonding strength; polyurethane system bonding strength is slightly lower than epoxy and acrylic systems, but much higher than silicone systems, stress is also Relatively low, but poor weather resistance
[0004] At present, the products used in the market are basically single-system products, and most of them are occupied by foreign brands, such as Dow Corning, Henkel, etc. Even so, the existing domestic and foreign conductive adhesive products cannot fully satisfy customers' requirements for adhesion, Requirements for electrical conductivity and weather resistance

Method used

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  • A kind of organosilicon modified polyurethane conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052]Silicone modified prepolymer: use professional synthesis equipment (with stirrer, condensate return pipe, temperature sensor, gas protection device-nitrogen, etc.), weigh 30g of silicone oil of structural formula (3) (where n=1) and 15g Put polyol D (where m=4) of structural formula (1) into a container, heat to 120°C for 1.5h under reduced pressure, then cool down to 55°C, then add 30g of isocyanate A and 10g of isocyanate B, 0.05g of catalyst, after 30min Raise the temperature to 80°C, react at 80°C for 4 hours, then cool down to 55°C, add 20g of castor oil, then raise the temperature to 80°C after 30min, and react at this temperature for 2h to obtain a silicone-modified prepolymer, and cool to room temperature.

[0053] Component A: Weigh 39g of the silicone-modified prepolymer prepared above, then weigh 1.8g of water-absorbing agent into a vacuum defoaming mixing equipment, mix well, then add 60g of flake silver powder (particle size 5 microns), mix Uniformly, A comp...

Embodiment 2

[0056] Silicone modified prepolymer: use professional synthesis equipment, weigh 25g of silicone oil of structural formula (3) (where n=10) and 10g of polyol D of structural formula (1) (where m=5) into a container, heat to Dehydration under reduced pressure at 120°C for 1.5h, then lower the temperature to 55°C, add 35g of isocyanate A and 13g of isocyanate B, 0.07g of catalyst, heat up to 80°C after 30min, react at 80°C for 4h, then cool down to 55°C, then add 25g of castor Sesame oil, then heated up to 80°C after 30 minutes, and reacted at this temperature for 2 hours to obtain a silicone-modified prepolymer, and cooled to room temperature.

[0057] Component A: Weigh 38.5g of the silicone-modified prepolymer prepared above, then weigh 1.5g of water-absorbing agent into the vacuum defoaming mixing equipment, mix evenly, and then add 61.5g of silver-coated copper powder (particle size 10 microns ), and mix evenly to obtain component A.

[0058] Component B: First, polyol D a...

Embodiment 3

[0060] Silicone modified prepolymer: use professional synthesis equipment, weigh 20g of silicone oil of structural formula (3) (where n=20) and 5g of polyol D of structural formula (1) (where m=3) into a container, heat to Dehydration under reduced pressure at 120°C for 1.5h, then lower the temperature to 55°C, then add 40g of isocyanate A and 15g of isocyanate B, 0.10g of catalyst, heat up to 80°C after 30min, react at 80°C for 4h, then cool down to 55°C, then add 30g of castor Sesame oil, then heated up to 80°C after 30 minutes, and reacted at this temperature for 2 hours to obtain a silicone-modified prepolymer, and cooled to room temperature.

[0061] Component A: Weigh 38g of the silicone-modified prepolymer prepared above, then weigh 2g of water-absorbing agent into the vacuum defoaming mixing equipment, mix evenly, then add 59.5g of gold powder (particle size 20 microns), mix evenly, A component is prepared.

[0062] Component B: First, polyol D and polyol E are dehydr...

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Abstract

The invention provides a silicone-modified polyurethane conductive adhesive; the conductive adhesive is prepared by the following method: Step 1: Preparation of a silicone-modified prepolymer: isocyanate A 3-4, isocyanate B 1-1.5, polyol D 0.5 ~1.5, castor oil 2~3, silicone oil 2~3, catalyst 0.005~0.01; Step 2: Preparation of component A: the weight ratio of each component is: silicone modified prepolymer 38.0~39.0, water absorbent 1.5~ 2.0, conductive filler 59.3-61.5; Step 3: Preparation of component B: the weight ratio of each component is: polyol D 28.05-28.65, polyol E 18.10-18.40, chain extender 1.60-2.00, water-absorbing agent 4.0-4.5 , catalyst 0.024~0.026, conductive filler 207.1~214.3; the two-component design not only improves the operability of the process, but also avoids the use of solvents; under the premise of ensuring the bonding strength, the weather resistance of the product is improved, and the product is also improved. The storage stability is guaranteed; the use of suitable conductive fillers ensures excellent electrical conductivity.

Description

technical field [0001] The invention belongs to the field of conductive adhesives, in particular to a two-component polyurethane conductive adhesive modified by organic silicon and castor oil. Background technique [0002] Conductive adhesive is mainly composed of resin matrix and conductive particles. The conductive particles provide conductivity to the conductive adhesive, while the resin matrix imparts physical and mechanical properties to the conductive adhesive. Compared with the soldering process, the conductive adhesive technology has various advantages, such as environmental friendliness, mild process conditions, simpler process and high line resolution. Conductive adhesives are used in the electronics industry, substitutes for tin-lead solder, bonding of electrode sheets and magnet crystals in ferroelectric devices, and structural adhesives. [0003] Conductive adhesive can be divided into epoxy resin system, acrylate resin system, silicone resin system, polyureth...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J175/14C09J11/04C08G18/12C08G18/67C08G18/61C08G18/32
CPCC09J9/02C09J175/14C09J11/04C08G18/12C08G18/36C08G18/61C08G18/3215C08K2201/001C08K2003/0806C08K2003/085C08K2003/0831C08G18/3893C08G18/324C08K7/00C08K7/26C08K9/10C08K3/08
Inventor 施凤艳陈维
Owner 芯嵛半导体(上海)有限公司
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