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3D flex-foil package

A technology for packaging terminals and electronic devices, which is used in semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as increasing integration density

Active Publication Date: 2020-09-04
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the prior art, for SMD in the form of wafer-level packaging (such as wafer-level chip-scale packaging WL-CSP or fan-out wafer-level packaging), there are alternative methods, otherwise increasing the integration density by flip-chip assembly

Method used

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Examples

Experimental program
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Embodiment Construction

[0027] Embodiments will be described in more detail below with reference to the accompanying drawings, in which elements having the same or similar functions bear the same reference numerals.

[0028] Method steps shown in the block diagrams and method steps discussed in connection with the block diagrams may also be performed in an order different from that shown or described. Additionally, a method step relating to a feature of an apparatus may be interchanged with that feature of the apparatus, and vice versa.

[0029] Additionally, standardized packages are exemplarily described here using examples of SMD packages or QFN packages. However, the invention also relates to packaging conforming to other standards.

[0030] The foil-based package of the present invention is also called foil package, flexible foil package or 3D flexible foil package. Additionally, the terms "package" and "housing" are used as synonyms. When referring to foil-based packaging, the term "ultra-th...

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Abstract

The invention relates to a foil-based package 10 having at least one foil substrate 11 having an electrically conductive layer 12 arranged thereon, at least one electronic device 13 having a device terminal pad 15 having at least one device terminal pad 14, and a plurality of package terminal pads 17a, 17b arranged on a package terminal side 16. The foil substrate 11 includes a first foil portionA1 and a second foil portion A2, the first foil portion A1 extending along a first foil plane E1 and the second foil portion A2 extending along a second foil plane E2 parallel to the first foil planeE1, the first foil plane E1 and the second foil plane E2 being offset relative to each other so that the foil substrate 11 forms a recess 18 within which the at least one electronic device 13 is arranged.

Description

technical field [0001] The present invention relates to a foil-based package for an electronic device, and in particular to an ultra-thin 3D flexible foil package comprising a recess in which the electronic device is at least partially arranged. Background technique [0002] Today, a large number of electronic devices with standardized packages are available on the market. Among these are, for example, SMD (Surface Mount Device) packages or QFN (Quad Flat No-lead) packages, as well as many other standardized forms. For example, for SMD packages there is a standardization for defining the geometry of the package in terms of width, length and height. In addition, the geometry of the electrical contact pads (SMD pads) is defined, for example, where a signal path passes from the system environment (eg printed circuit board) to an internal semiconductor device (eg chip). [0003] In order to ensure the compatibility of the signal path, the order and geometric position of the SM...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L23/31H01L21/50H01L21/56
CPCH01L23/49838H01L23/49855H01L23/3114H01L23/3121H01L21/50H01L21/563H01L23/4985H01L23/562H01L23/544H01L23/49811H01L23/3185H01L2223/54486H01L2223/54433H01L2224/73204H01L24/16H01L2224/32225H01L2224/83851H01L2224/131H01L2924/15151H01L2224/32057H01L2224/16238H01L2224/1134H01L2224/81903H01L2224/9211H01L2924/1815H01L2924/00014H01L2224/81H01L2224/83H01L2224/16225H01L2924/00H01L2224/73221H01L23/48H01L24/35H01L23/3164H01L23/315H01L24/13H01L2224/03436H01L2224/48248H01L2224/73265H01L2224/32257H01L24/29
Inventor 罗伯特·福尔
Owner FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG EV
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