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A method and device for prestack depth migration of variable offset vsp converted shear wave one-way wave

A technology for pre-stack depth migration and conversion of shear waves, which can be used in measurement devices, seismology, instruments, etc., and can solve the problem of less converted shear waves.

Active Publication Date: 2022-05-20
OPTICAL SCI & TECH (CHENGDU) LTD
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Problems solved by technology

However, research on variable offset VSP migration imaging mainly focuses on time-domain P-waves and depth-domain P-waves, with few converted S-waves.

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  • A method and device for prestack depth migration of variable offset vsp converted shear wave one-way wave
  • A method and device for prestack depth migration of variable offset vsp converted shear wave one-way wave
  • A method and device for prestack depth migration of variable offset vsp converted shear wave one-way wave

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Embodiment Construction

[0089] The technical solution of the present invention will be further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following description.

[0090] Such as figure 2 As shown, a variable offset distance VSP converted shear wave one-way wave prestack depth migration method includes the following steps:

[0091] S1. Input variable offset distance VSP common receiver point reflection converted shear wave wave field, longitudinal wave 2D geological model, shear wave 2D geological model, offset parameters:

[0092] S101. Input variable offset distance VSP common receiver point reflection conversion shear wave field data {VSPData}, read shot point coordinates {SX, SY}, shot point depth SZ, receiver point coordinates {RX, RY}, receiver point depth RZ , Wellhead geodetic coordinates {WMX, WMY};

[0093] S202. Input the longitudinal wave 2D grid layer velocity geological model {V p}, ...

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Abstract

The invention discloses a variable offset VSP converted shear wave one-way wave prestack depth migration method and device. The method includes the following steps: S1. Input the variable offset VSP common receiver point reflection converted shear wave wave field, longitudinal wave 2 Three-dimensional geological model, shear wave 2-dimensional geological model, and migration parameters; S2. According to the input data, establish the coordinates of the shot point and the receiver point in the 2-dimensional geological model; S3. Lie transform to the frequency wavenumber domain, and set the frequency domain seismic source; S4. Realize the one-way wave prestack depth migration imaging of a single receiver point; S5. Complete the variable offset VSP conversion shear wave one-way wave prestack depth migration imaging of all receiver points S6. Co-imaging gather stacking to obtain variable offset VSP converted shear wave one-way wave prestack depth migration stacked imaging. The invention realizes the one-way wave prestack depth migration imaging of the VSP common receiver point with variable offset distance, and obtains the superposition imaging of VSP with variable offset distance, which provides data support for the study of side-hole structures and prediction of reservoirs.

Description

technical field [0001] The invention relates to seismic data migration imaging, in particular to a VSP converted shear wave one-way wave prestack depth migration method and device. Background technique [0002] Converted shear wave exploration is usually excited by a longitudinal wave source, received by a multi-component geophone, and simultaneously obtains longitudinal wave data and converted shear wave data. Converted shear wave data are mainly used for structural imaging, lithology identification, elastic parameter inversion and fracture development prediction, etc. [0003] Variable offset VSP means that an array composed of multiple geophones is placed in the observation well, and a shot line composed of artificially excited multiple shot points is arranged on the surface. It is a two-dimensional observation method of VSP. Under the condition of the data, the data acquisition in the VSP well with variable offset distance is realized. The three-dimensional diagram of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01V1/28G01V1/34G01V1/36
CPCG01V1/282G01V1/345G01V1/362G01V2210/512G01V2210/74
Inventor 李建国王熙明刘博李飞
Owner OPTICAL SCI & TECH (CHENGDU) LTD