Method for interplanting high-quality and high-yield corn with soybean

A corn and soybean technology, applied in application, organic fertilizer, nitrogen fertilizer, etc., can solve problems such as agricultural ecological deterioration

Inactive Publication Date: 2020-10-23
那郅烨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Aiming at the prior art of interplanting soybeans with corn which leads to a large amount of use of chemical fertilizers and pesticides, thereby bringing about

Method used

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  • Method for interplanting high-quality and high-yield corn with soybean

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Experimental program
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Effect test

Embodiment 1

[0038] A method for interplanting soybeans with high-quality and high-yield corn, comprising the steps of:

[0039] 1. Seed selection: choose cob corn and dense pod soybeans as seeds;

[0040] 2. Seed treatment: thinly spread the corn and soybean seeds on the ground in sunny days, and turn them in the sun continuously for 1 day to remove impurities and moldy seeds; then apply the following foliar fertilizers to the sun-dried corn and soybean seeds respectively: Rhodiola 13 11 parts of undead, 90 parts of Hedyotis diffusa, 80 parts of Daqingye, 7 parts of Astragalus, 25 parts of Forsythia, 90 parts of elemental element Fe, 175 parts of elemental element Mn, 90 parts of elemental element Cu, 230 parts of elemental element Zn, elemental element 15 parts of element Mo, 6 parts of simple element B;

[0041] Dilute to 80 times the solution and soak the seeds for 50 hours, remove and rinse with water for 3 times, spread thinly in a ventilated and sun-shielded place to dry, and obtai...

Embodiment 2

[0062] A method for interplanting soybeans with high-quality and high-yield corn, comprising the steps of:

[0063] 1. Seed selection: choose big cob corn and black soybean as seeds;

[0064] 2. Seed treatment: thinly spread the corn and soybean seeds on the ground in sunny days, and turn them in the sun for 2 days continuously to remove impurities and moldy seeds; then apply the following foliar fertilizers to the sun-dried corn and soybean seeds respectively: Rhodiola 10 10 parts of undead, 80 parts of Hedyotis diffusa, 70 parts of Daqingye, 5 parts of Astragalus, 15 parts of Forsythia, 80 parts of elemental element Fe, 150 parts of elemental element Mn, 80 parts of elemental element Cu, 120 parts of elemental element Zn, elemental element 10 parts of element Mo, 5 parts of elemental element B;

[0065] Dilute to 110 times the solution and soak the seeds for 18 hours, remove and rinse twice with clean water, spread thinly in a ventilated and sun-shielded place to dry, and o...

Embodiment 3

[0086] A method for interplanting soybeans with high-quality and high-yield corn, comprising the steps of:

[0087] 1. Seed selection: choose big cob corn and black soybean as seeds;

[0088] 2. Seed treatment: thinly spread the corn and soybean seeds on the ground in sunny days, and turn them in the sun continuously for 1 day to remove impurities and moldy seeds; then apply the following foliar fertilizers to the sun-dried corn and soybean seeds respectively: Rhodiola 20 15 parts, 15 parts of undead, 100 parts of Hedyotis diffusa, 100 parts of Daqingye, 10 parts of Astragalus, 40 parts of Forsythia, 100 parts of elemental element Fe, 200 parts of elemental element Mn, 100 parts of elemental element Cu, 300 parts of elemental element Zn, elemental element 20 parts of element Mo, 10 parts of simple element B;

[0089] Dilute to 20 times the solution and soak the seeds for 12 hours, remove and rinse twice with clean water, spread thinly in a ventilated and sun-shielded place to...

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Abstract

The invention provides a method for interplanting high-quality and high-yield corn with soybean. The method comprises the steps of seed selection, seed treatment, soil preparation, sowing, soil covering, film mulching, fertilization, growth period management and harvesting. Two rows of corn and four rows of soybean are planted, the corn and the soybean are matched in height, no chemical or pesticide is applied in the whole planting process, and only a foliar fertilizer is sprayed. During seed treatment, the seeds are soaked with the same foliar fertilizer, the vigor of the seeds is increased from the beginning, and the germination rate is improved. After seedling emergence, root systems are developed, leaves are fat, stems are thick, leaves are dark green, the growth vigor is vigorous in the seedling stage, and sufficient water and fertilizer energy supply is ensured by powerful root system plants. While plants are sufficiently supplied to grow quickly, the bidirectional stress resistance of plant diseases, insects, drought, waterlogging, low temperature, high temperature, even saline-alkali soil and the like is remarkably enhanced, high yield and high quality are achieved withoutchemical fertilizers and pesticides, the yield per mu of corn is 1400 kg or above, the hundred-grain weight of the corn is 42-52 g, and the yield per mu of the soybean is 400 kg or above.

Description

technical field [0001] The invention relates to a planting method, in particular to a method for interplanting soybeans with high-quality and high-yield corn, and belongs to the technical field of agricultural planting. Background technique [0002] As a mature high-yield cultivation model, interplanting soybean with corn has been widely used in my country. Its characteristics are that it can relatively improve the use of light energy and land resources, expand the multiple cropping index of dry land, increase the sown area of ​​grain and oil, and improve the comprehensive economic benefits per unit area. The implementation of interplanting soybeans with corn can make full use of the advantages of growing space and side rows, improve land utilization rate and yield per unit area, realize height matching, and complement each other's advantages. However, due to the strong competition between corn plants and the characteristics of bullying the small, high-yield corn needs to be...

Claims

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Application Information

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IPC IPC(8): A01G22/20C05G3/00C05G3/60C05G3/80C05G5/20
CPCA01G22/20C05B7/00C05D9/02C05G3/00C05G3/60C05G3/80C05G5/20C05F11/00C05C9/00C05D5/00Y02P20/133
Inventor 那郅烨杨红军杨地
Owner 那郅烨
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