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Solder paste

A technology of solder paste and flux, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as thermal damage of components

Inactive Publication Date: 2020-11-13
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the reflow temperature is set high, the electronic components mounted on the printed circuit board will be exposed to high temperature environment, and the components may suffer thermal damage

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0072] ●The production of paste

[0073] For two or one alloy powders having the alloy compositions shown in Tables 1 to 3, alloy powders having a spherical diameter of 21 μm and corresponding to 5 in the powder size classification (Table 2) of JIS Z3284-1:2014 were prepared. The content of each powder shown in Tables 1 to 3 represents a mass ratio (mass %) with respect to the total mass of the powder. Then, it was mixed with a known paste-like rosin-based flux, and the solder pastes of Examples 1 to 45 and Comparative Examples 1 to 4 were prepared. In this solder paste, the alloy powder is 90% of the total mass of the solder paste.

[0074] ●Pore area ratio, maximum pore diameter

[0075] For these pastes, on a Cu-OSP glass epoxy substrate, a metal mask was used to make a thickness of 0.15 mm. t The thickness of the above paste is printed. Then, a QFN of 8mm x 8mm x 2mm was placed on the paste using a chip mounter. Then, it was put into a reflow oven, and the peak temper...

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Abstract

Provided is a solder paste that shows reduced void formation and has a high reliability. The solder paste comprises an Sn-based powder, an SnSb-based alloy powder containing Sn and 10 mass% or more ofSb, and a flux, wherein: the liquid phase line temperature of the SnSb-based alloy powder is higher than the liquid phase line temperature of the Sn-based powder; and the content ratio of the Sn-based powder to the SnSb-based alloy powder is 75:25-95:5. Preferably, the content ratio of the Sn-based powder to the SnSb-based alloy powder is 80:20-90:10.

Description

technical field [0001] The present invention relates to a solder paste that suppresses the generation of voids and is excellent in reliability. Background technique [0002] In recent years, in automobiles, higher functions and higher performances have been sought by electrifying components consisting only of mechanical components. In order to realize high functionality and high performance of automobiles, electronic mounting technology corresponding to small size and high density is required. In order to cope with this mounting technique, high reliability is required for solder joints connecting printed circuit boards and electronic components. [0003] For example, a printed circuit board mounted near an engine is required to be used for a long time with a significant temperature difference. A hybrid vehicle is equipped with an inverter that handles large electric power, and a solder joint that can withstand the driving temperature of the inverter is required. Thus, in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/26C22C12/00C22C13/00C22C13/02C22C28/00
CPCB23K35/262B23K35/22B23K35/26C22C12/00C22C13/00C22C13/02C22C28/00B23K35/0244
Inventor 坂本健志立花芳惠小贺俊辅
Owner SENJU METAL IND CO LTD