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Manufacturing method of chip packaging structure and plastic packaging mold

A technology of chip packaging structure and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve the problems of affecting product performance, difficulty in manufacturing, and high cost of chip packaging, avoiding separation and saving stickiness. The effect of glue dosage

Active Publication Date: 2021-01-15
SIPLP MICROELECTRONICS CHONGQING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product
[0003] However, the existing chip packaging costs are high and production is difficult

Method used

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  • Manufacturing method of chip packaging structure and plastic packaging mold
  • Manufacturing method of chip packaging structure and plastic packaging mold
  • Manufacturing method of chip packaging structure and plastic packaging mold

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0056] In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0057] figure 1 It is a flowchart of a manufacturing method of a chip package structure according to an embodiment of the present invention. Figure 2 to Figure 5 , Figure 8 to Figure 19 yes figure 1 The schematic diagram of the intermediate structure corresponding to the process in . Figure 6 and Figure 7 The schematic diagrams of the structures of the two plastic packaging molds are shown respectively.

[0058] First, refer to figure 1 Step S1 in, figure 2 and image 3 As shown, a carrier 2 and a plurality of dies 101 are provided, each die 101 includes a front side 101a and a back side 101b, and the front side 101a has an electrical interconnection structure; in, figure 2 is a top view of the carrier board and multiple die...

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PUM

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Abstract

The invention provides a manufacturing method of a chip packaging structure, and a plastic packaging mold. In the manufacturing method of the chip packaging structure, an annular glue accommodating groove is arranged on the outer surface of a first plastic packaging layer, and a glue accommodated in the glue accommodating groove is also annularly distributed, so that the first plastic packaging layer and a support plate are bonded through the annular glue, and compared with a mode of distributing glue on the whole surface between the first plastic package layer and the support plate, the use amount of the glue can be saved, the cost is reduced, and the difficulty in stripping the support plate is reduced; and in a process of forming at least outer pins on the front surface of each crystalgrain, an immersion type process may be involved, and the annular glue is arranged around at least all the crystal grains for one circle, so that a liquid in the immersion type process cannot enter the space between the first plastic packaging layer and the support plate, and separation of the first plastic packaging layer and the support plate is avoided.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a method for manufacturing a chip packaging structure and a plastic packaging mold. Background technique [0002] In recent years, with the continuous development of circuit integration technology, electronic products are increasingly developing in the direction of miniaturization, intelligence, high performance and high reliability. Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product. [0003] However, the existing chip packaging costs are relatively high and production is difficult. [0004] In view of this, the present invention provides a new manufacturing method of a chip packaging structure and a plastic packaging mold to solve the above technical problems. Contents of the invention [0005] The purpose of the present invention is to provide a method for manufacturing a chip packaging structu...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L21/67
CPCH01L21/56H01L21/67011H01L2224/18
Inventor 周辉星
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD
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