The invention relates to a packaging method of a display
chip and a mold. The packaging method of the display
chip comprises the following steps that a substrate is provided, the surface of one side of the substrate is provided with a plurality of display
chip modules extending in the first direction, and a
cutting channel extending in the first direction is formed between every two adjacent display chip modules; a mold is arranged on the face, provided with the display chip module, of the substrate, the mold comprises a plurality of strip-shaped structures extending in the first direction, and orthographic projections of the strip-shaped structures on the substrate are located in the
cutting channels; forming a packaging layer on the surface, provided with the display chip module, of the substrate, wherein the packaging layer covers the display chip module, the side wall of the strip-shaped structure and the exposed surface of the substrate; and removing the mold. According to the packaging method of the display chip, the chip packaging technology is not limited by the shape and the size of the substrate, so that the packaging cost of the Micro LED is reduced.