Method of preparing SiCp/Al composite material with complicated shape and high volume percent ratio

A technology of composite materials and complex shapes, which is applied in the field of preparation of SiCp/Al composite materials with complex shapes and high volume ratios, achieving high dimensional accuracy, low cost, and good performance
CN101016591AInactive Publication Date: 2007-08-15UNIV OF SCI & TECH BEIJING

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
UNIV OF SCI & TECH BEIJING
Publication Date
2007-08-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a preparing method of SiCp / Al composite with complete shape and high analytic in metal base composite material researching domain, which comprises the following steps: allocating pre-mixing liquid with monomer, cross linker and disperser; adding into SiC powder; balling; getting stable suspension with SiC volume content at 50-70%; adding into trigger and activator; stirring evenly; injecting into unapertured mold; solidifying and shaping in incubator with temperature at 50-70 deg.c; getting green compact; drying; discharging glue; presintering; getting SiC bone; placing Al alloy of 4-8% Mg, 6-12% Si on the adaptive position of bone; putting into heater; heating-up at 900-1200 deg.c under the protection of inert gas; inflating high pure nitrogen; keeping the temperature at 1-6 h; cooling; getting the product. This invention possesses the merit of cheap cost.
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Description

technical field

[0001] The invention belongs to the research field of metal matrix composite materials, and in particular provides a SiC with complex shape and high volume ratio p / Al composite preparation method. Background technique

[0002] High volume fraction (50-70%) SiC p / Al composite material combines the excellent properties of metal aluminum and SiC, and has excellent physical and mechanical properties, such as high elastic modulus, high specific strength, good thermal conductivity, etc., and is widely used in electronic packaging, aerospace and other fields. It has a wide range of application prospects, and it has always been one of the hottest topics in the field of metal matrix composites research in terms of theory and practical application. A large number of preparation methods have emerged, such as casting, spray deposition, powder metallurgy, etc. However, these methods generally have the disadvantages of high cost, uneven material structure, poor perform...

Claims

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