Semiconductor device chip mounting device

A patch device and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as irregular placement of semiconductor devices, offset of semiconductor fixed positions, etc., to solve placement errors and improve quality and efficiency, the effect of improving efficiency

Inactive Publication Date: 2021-02-02
陈圆圆
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The technical problem to be solved by the present invention is that artificial long-time placement is like

Method used

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  • Semiconductor device chip mounting device
  • Semiconductor device chip mounting device
  • Semiconductor device chip mounting device

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be constr...

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Abstract

The invention relates to the field of semiconductor devices, particularly to a semiconductor device chip mounting device, which comprises a base, a workbench, two lifting mechanisms, clamping mechanisms, ascending mechanisms, moving mechanisms, a chip mounting moving mechanism and a chip mounting mechanism, wherein the workbench is fixedly arranged above the base, the two lifting mechanisms are symmetrically and fixedly arranged on one side of the workbench, the two clamping mechanisms are fixedly connected with the one lifting mechanisms respectively, the two moving mechanisms are arranged onthe workbench, the four ascending mechanisms are arranged on the workbench, the four lifting mechanisms are symmetrically arranged on one side of the workbench in pairs, the chip mounting moving structure is arranged between the two moving mechanisms, and the chip mounting mechanism is fixedly arranged below the chip mounting moving mechanism. According to the invention, through cooperation of all the components, the problem of position deviation during chip mounting is solved, and the chip mounting efficiency and accuracy are improved.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a semiconductor device patching device. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. The semiconductor material of semiconductor devices is silicon, germanium or gallium arsenide, which can be used as rectifiers, oscillators, light emitters, amplifiers, photometers and other equipment. [0003] At present, most of the placement of semiconductor devices is handled manually. If the placement operation is carried out manually for a long time, it is very easy to produce large errors, resulting in irregular placement of semiconductor devices. Semiconductor devices are generally fixed ...

Claims

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Application Information

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IPC IPC(8): H01L21/687H01L21/67
CPCH01L21/67144H01L21/67253H01L21/68721H01L21/68764
Inventor 陈圆圆
Owner 陈圆圆
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