Water-cooling high-power full-bridge unit based on crimping type IGCT

A high-power, crimp-type technology, applied in the direction of output power conversion devices, electrical components, cooling/ventilation/heating transformation, etc., can solve the problems of large thermal resistance of module packaging devices, improve power density and reduce failure rate , the effect of strong flow capacity

Pending Publication Date: 2021-06-11
TSINGHUA UNIV +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the module packaging device has a large thermal resistance, how to dissipate heat for it is a problem that needs to be solved at present

Method used

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  • Water-cooling high-power full-bridge unit based on crimping type IGCT
  • Water-cooling high-power full-bridge unit based on crimping type IGCT
  • Water-cooling high-power full-bridge unit based on crimping type IGCT

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Embodiment Construction

[0026] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0027] Such as Figure 1-3 As shown, a water-cooled high-power full-bridge unit based on a press-fit IGCT, the unit includes: a power supply module 2; an IGCT full-bridge power module 1 installed under the power supply module 2; a DC capacitor module 3 connected through The busbar 4 is connected to the IGCT full-bridge power ...

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Abstract

The invention discloses a water-cooling high-power full-bridge unit based on a crimping type IGCT. The water-cooling high-power full-bridge unit comprises a power supply module, wherein an IGCT full-bridge power module is arranged below the power supply module; and a direct current capacitor module is connected with the IGCT full-bridge power module through a connecting busbar. According to the water-cooling high-power full-bridge unit, the modular design and the water-cooling heat dissipation technology are adopted, so that the structure is compact and attractive; electromagnetic compatibility and reasonable circuit distribution are realized; the whole unit as well as internal modules and units are convenient to install and maintain; the water-cooling high-power full-bridge unit has the advantages of being high in through-current capacity, low in on-state voltage drop, short-circuit in failure, high in series connection reliability and the like, IGCT devices are small in difference, and series connection voltage sharing is guaranteed to a certain degree; integrated design is realized; the heat dissipation effect is improved, and the water-cooling radiator has good isothermal performance; and the water-cooling high-power full-bridge unit has the advantages of small occupied area, high reliability, strong controllability, low technical price and the like, and has a good prospect.

Description

technical field [0001] The invention belongs to the field of power electronics, in particular to a water-cooled high-power full-bridge unit based on a press-connected IGCT. Background technique [0002] Power semiconductor devices are the basis of complete power electronics devices, which directly affect their cost, efficiency, and reliability. At present, high-power silicon-based semiconductor technologies include module-packaged insulated-gate bipolar transistors (IGBTs), press-packed IGBTs, and press-packed integrated gate-commutated thyristors (IGCTs). For applications, there are fewer restrictions on installation conditions. However, the module packaging device has a large thermal resistance, how to dissipate heat for it is a problem that needs to be solved at present. Contents of the invention [0003] In view of the above-mentioned technical problems in the related art, the present invention proposes a water-cooled high-power full-bridge unit based on a press-conn...

Claims

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Application Information

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IPC IPC(8): H02M1/00H01L23/473H05K7/20
CPCH02M1/00H05K7/20218H01L23/473
Inventor 赵彪蔡放曾嵘余占清白羽刘滨胡茂良崔康生汤雪腾
Owner TSINGHUA UNIV
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