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Processing water supply system

A processing device and cooling water technology, applied in metal processing equipment, control/regulation systems, metal processing machinery parts, etc., can solve problems such as inability to discharge cooling water

Pending Publication Date: 2021-12-07
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Here, an upper limit (for example, 30° C.) of an allowable temperature is set for the drainage flowing through the drainage facility. When the temperature of water exceeds the upper limit (for example, 40°C to 60°C), there is a problem that the cooling water cannot be discharged to the drainage equipment.

Method used

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  • Processing water supply system

Examples

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Comparison scheme
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Embodiment Construction

[0015] Hereinafter, a processing water supply system according to an embodiment of the present invention will be described in detail with reference to the drawings.

[0016] figure 1 The processing water supply system 100 of this embodiment and the cutting device 1 provided as a processing device to which the processing water supply system 100 is applied are shown.

[0017] A workpiece processed by the cutting device 1 is a wafer U held by an annular frame F via an adhesive tape T. As shown in FIG. The cutting device 1 includes at least: a chuck table 6 holding a wafer U; and a cutting unit 8 serving as a processing unit that performs cutting processing while supplying processing water to the wafer U held by the chuck table 6 . A plurality of wafers U are accommodated in a cassette 2 (indicated by a dashed-two dotted line) and carried into the cutting apparatus 1 .

[0018] The wafer U accommodated in the cassette 2 is carried by the loading / unloading unit 3 onto the tempora...

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PUM

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Abstract

The invention provides a processing water supply system which can adjust the temperature to a temperature allowed by a drainage device even if cooling water is used for cooling processing water of a processing device and the temperature is higher than the upper limit temperature. The processing water supply system for supplying processing water to a processing apparatus includes a first heat exchanger that cools the processing water by heat of vaporization of a cooling medium, a second heat exchanger that cools the cooling medium compressed to reach a high temperature, a cooling water receiving route that receives the cooling water from cooling water supply equipment to the second heat exchanger, a cooling water drain route that drains the cooling water heat-exchanged by the second heat exchanger to reach a high temperature to drain equipment, and a bypass route that is disposed between the cooling water receiving route and the cooling water drain route and adjusts the cooling water reaching the high temperature at the second heat exchanger to a temperature permissible by the drain equipment.

Description

technical field [0001] The present invention relates to a processing water supply system for supplying processing water to a processing device performing processing while supplying processing water to a workpiece. Background technique [0002] A wafer divided by a plurality of intersecting dividing lines and formed with multiple devices such as ICs and LSIs on the front side is divided into individual device chips by a dicing device, and the divided device chips are used in electronic equipment such as mobile phones and personal computers. [0003] The dicing device is configured to include: a chuck table that holds the wafer; a cutting unit that has a cutting blade that performs cutting while supplying processing water to the wafer held by the chuck table; and a feed mechanism that This enables the wafer to be divided into individual device chips with high precision by processing and feeding the chuck table and the cutting unit relative to each other (for example, refer to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28F27/02
CPCF28F27/02H01L21/67017H01L21/67109H01L21/67248H01L21/67092G05D23/1925B23Q11/10B23Q11/12F28F2265/22F28F17/00
Inventor 松本正臣齐藤优
Owner DISCO CORP