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Intrinsic low-dielectric fluorine-containing polyimide film and preparation method thereof

A technology of fluorine-containing polyimide and low dielectric, which is applied in the field of intrinsic low-dielectric fluorine-containing polyimide film and its preparation, can solve the problem of heat resistance degradation, increase of inter-molecular chain gaps, molecular Unreasonable structural design and other issues, to achieve the effect of improving performance, low dielectric thermal stability, and promoting rapid development

Pending Publication Date: 2022-03-25
SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, the poor compatibility between fluorine-containing silane and polyimide molecules will lead to a decrease in mechanical properties
[0008] CN109942815B invented a low-dielectric polyimide resin, and proposed a polyimide composite resin obtained by uniform copolymerization of polyimide and polymethylimide, through the introduction of polymethylimide units, to reduce polyimide The dielectric constant of the imide composite resin has a branched chain structure, which not only increases the gap between the molecular chains, further reduces the dielectric constant, but also improves the mechanical properties of the introduced polymethylimide resin. Amination, and the addition of polymethylimine will lead to stronger molecular chain rigidity, which will affect its solubility and processability
[0010] In summary, although a series of improvements have been made, low-dielectric polyimide still has poor solubility, difficulty in controlling the uniformity of inorganic fillers, decreased mechanical properties, and unreasonable molecular structure design leading to decreased heat resistance. And other issues

Method used

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  • Intrinsic low-dielectric fluorine-containing polyimide film and preparation method thereof
  • Intrinsic low-dielectric fluorine-containing polyimide film and preparation method thereof
  • Intrinsic low-dielectric fluorine-containing polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Prepare the intrinsic low dielectric fluorine-containing polyimide film according to the following method:

[0034] (1) Add 2.01g of 4,4'-diamino-3,3'-bis(trifluoromethyl)diphenylcyclohexanediamine monomer to a four-necked flask containing 24.08g of DMAc, under nitrogen protection , stirred to dissolve it; weighed 2.24g of 6FDA dianhydride monomer and added it to the above solution in batches under stirring conditions, stirred at 40°C for 4h, and obtained polyamic acid solution through polycondensation reaction;

[0035] (2) Add catalyst triethylamine 1.52g and dehydrating agent acetic anhydride 1.531g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0036] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a low-dielectric fluorine-containing polyimide film.

[0037] The properties of the obtained polyimide film were characteriz...

Embodiment 2

[0039] Prepare the intrinsic low dielectric fluorine-containing polyimide film according to the following method:

[0040] (1) Add 2.01g of 4,4'-diamino-3,3'-bis(trifluoromethyl)diphenylcyclohexanediamine monomer to a four-necked flask containing 24.48g of DMAc, under nitrogen protection , stirred to dissolve it; weighed 2.31g of 6FCDA dianhydride monomer and added it to the above solution in batches under stirring conditions, stirred at 40°C for 4h, and obtained polyamic acid solution through polycondensation reaction;

[0041] (2) Add 1.52 g of catalyst triethylamine and 1.53 g of dehydrating agent acetic anhydride to the above polyamic acid solution for chemical imidization, stir at 40° C. for 8 h to obtain a polyimide solution;

[0042] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a low-dielectric fluorine-containing polyimide film.

[0043] The properties of the obtained polyimide film were ch...

Embodiment 3

[0045] Prepare the intrinsic low dielectric fluorine-containing polyimide film according to the following method:

[0046] (1) Add 2.01g of 4,4'-diamino-3,3'-bis(trifluoromethyl)diphenylcyclohexanediamine monomer to a four-necked flask containing 24.70g of DMAc, under nitrogen protection , stir to dissolve it; weigh 2.35g of 3FCDA dianhydride monomer and add it to the above solution in batches under stirring conditions, stir at 40°C for 4h, and obtain a polyamic acid solution through polycondensation reaction;

[0047] (2) Add 1.52 g of catalyst triethylamine and 1.53 g of dehydrating agent acetic anhydride to the above polyamic acid solution for chemical imidization, stir at 40° C. for 8 h to obtain a polyimide solution;

[0048] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a low-dielectric fluorine-containing polyimide film.

[0049] The properties of the obtained polyimide film were characteri...

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Abstract

The invention belongs to the technical field of polyimide films, and particularly relates to an intrinsic low-dielectric fluorine-containing polyimide film and a preparation method thereof. The intrinsic type low-dielectric fluorine-containing polyimide film is obtained by condensation polymerization of 4, 4 '-diamino-3, 3'-bis (trifluoromethyl) diphenyl cyclohexane and an aromatic dianhydride monomer, and the 4, 4 '-diamino-3, 3'-bis (trifluoromethyl) diphenyl cyclohexane is synthesized by taking fluorinated 4, 4 '-diamino-3, 3'-dimethyl diphenyl cyclohexane as a raw material. A strong-polarity fluorine-containing group C-F bond introduced into a molecular chain is relatively low in polarizability, and meanwhile, the fluorine-containing group and an alicyclic structure destroy the regularity of the molecular chain and enlarge molecular space gaps, so that the number of polarized molecules in unit volume of the material is reduced, and the dielectric constant of the material is reduced; the molecular structure contains a large proportion of rigid structure benzene ring and nitrogen-containing hybridization, so that the fluorine-containing polyimide has excellent heat resistance and dimensional stability.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and in particular relates to an intrinsic low dielectric fluorine-containing polyimide film and a preparation method thereof. Background technique [0002] Dielectric polarization refers to the phenomenon that under the action of an external electric field, the bound charges inside the insulating medium move locally, resulting in the deviation of the center of positive and negative charges. The dielectric constant represents the polarization ability of the medium. The larger the value, the easier the medium is to be polarized, and the easier it is to store electrical energy. [0003] In the field of information technology industry, the development of multi-functional, high-performance and light-weight microelectronic products has greatly promoted the development of key technologies and materials for ultra-high-density and ultra-large-scale integrated circuits. However, the existence of p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1067C08G73/1071C08G73/1039C08J5/18C08J2379/08
Inventor 王汉利王俊莉王军顾萍杨振东李伟耿佃旭
Owner SHANDONG HUAXIA SHENZHOU NEW MATERIAL