High-transparency low-expansion polyimide film and preparation method thereof

A polyimide film and low-expansion technology, applied in the field of high-transparency and low-expansion polyimide film and its preparation, to achieve the effects of reducing thermal expansion coefficient, improving light transmittance, and low-expansion thermal stability

Pending Publication Date: 2021-03-09
SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Hasegawa et al. introduced amido and fluorine-containing groups into the polyimide molecular chain, the thermal expansion coefficient can be reduced to 9.9, but the light transmittance at 400nm is only 43.4%.

Method used

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  • High-transparency low-expansion polyimide film and preparation method thereof
  • High-transparency low-expansion polyimide film and preparation method thereof
  • High-transparency low-expansion polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Prepare high transparency and low expansion polyimide film according to the following method:

[0039] (1) Add 1.126g 2-(4-amino-phenyl)-benzoxazol-5-amine diamine monomer into a four-necked flask containing 18.252gDMAc, under nitrogen protection, stir to dissolve it; weigh Take 3.437g HTA-TFMB dianhydride monomer and add it to the above solution in batches under stirring condition, stir at 40°C for 4h, and obtain polyamic acid solution through polycondensation reaction;

[0040] (2) Add catalyst triethylamine 1.518g and dehydrating agent acetic anhydride 1.531g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0041] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0042] The performance of the obtained polyimide composite film was characterized, and the light transmittan...

Embodiment 2

[0044] Prepare high transparency and low expansion polyimide film according to the following method:

[0045] (1) Add 1.121g of 2-(4-aminophenyl)-5-aminobenzimidazolediamine monomer to a four-necked flask containing 18.232g of DMAc, and stir to dissolve it under nitrogen protection; weigh 3.437g HTA-TFMB dianhydride monomer was added to the above solution in batches under stirring conditions, stirred at 40°C for 4 hours, and polyamic acid solution was obtained through polycondensation reaction;

[0046] (2) Add catalyst triethylamine 1.518g and dehydrating agent acetic anhydride 1.531g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0047] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0048] The performance of the obtained polyimide composite film was characterized. The ligh...

Embodiment 3

[0050] Prepare high transparency and low expansion polyimide film according to the following method:

[0051] (1) Add 1.311g of 2,5-bis(4-aminophenyl)-pyrimidinediamine monomer into a four-necked flask containing 18.992g of DMAc, and stir to dissolve it under nitrogen protection; weigh 3.437g of HTA - TFMB dianhydride monomer is added to the above solution in batches under stirring conditions, stirred at 40°C for 4 hours, and polyamic acid solution is obtained through polycondensation reaction;

[0052] (2) Add catalyst triethylamine 1.518g and dehydrating agent acetic anhydride 1.531g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0053] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0054] The performance of the obtained polyimide composite film was characterized, and the ...

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Abstract

The invention particularly relates to a high-transparency low-expansion polyimide film and a preparation method thereof, and belongs to the technical field of high polymer material modification. The high-transparency low-expansion polyimide film disclosed by the invention is obtained by condensation polymerization of amide type fluorine-containing hydrogenated tetracarboxylic dianhydride HTA-TFMBor ester type fluorine-containing hydrogenated tetracarboxylic dianhydride HTA-TFBP and a nitrogen-containing aromatic diamine monomer; the polyimide has the following structural formula, wherein Ar represents a nitrogen-containing aromatic diamine residue; and n represents the polymerization degree and is greater than or equal to 400. The high-transparency low-expansion polyimide film disclosed by the invention has relatively high light transmittance, low expansion and thermal stability; and meanwhile, the invention provides a simple and feasible preparation method.

Description

technical field [0001] The invention specifically relates to a highly transparent and low-expansion polyimide film and a preparation method thereof, belonging to the technical field of polyimide modification. Background technique [0002] "Foldable / full screen" and "5G" related technology breakthroughs and application innovations are the two hottest elements in the consumer electronics industry in 2019. In addition to the hot spots, the outlets behind the trend all point to "polyimide film materials". Due to its excellent heat resistance and stability, polyimide materials can withstand high-temperature processes such as electrode film deposition and annealing treatment in the process of optoelectronic device processing. It is important to replace traditional hard glass with high-transparency and low-expansion polymers as cover materials. It is the key technology to realize the flexibility of display devices. However, the light transmittance of traditional aromatic polyimid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08
CPCC08G73/1085C08G73/1039C08G73/1007C08G73/1067C08J5/18C08J2379/08
Inventor 王汉利王俊莉顾萍杨振东
Owner SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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