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High-transparency low-expansion polyimide film and preparation method thereof

A polyimide film and low-expansion technology, applied in the field of high-transparency and low-expansion polyimide film material and its preparation, can solve the problems of high light transmission, low expansion, high heat resistance, etc., achieve high thermal stability, promote The effect of localization development and widening the light transmission range

Active Publication Date: 2020-05-08
SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, in view of the technical problems of high light transmission, low expansion, and high heat resistance at the same time, it is necessary to develop a new type of polyimide film so that it can be applied to flexible cover film

Method used

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  • High-transparency low-expansion polyimide film and preparation method thereof
  • High-transparency low-expansion polyimide film and preparation method thereof
  • High-transparency low-expansion polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Prepare high transparency and low expansion polyimide film according to the following method:

[0039] (1) Add 2.253g of 2-(4-amino-phenyl)-benzoxazol-5-amine diamine monomer into a four-necked flask containing 23.2g of DMAc, and stir to dissolve it under nitrogen protection; Weigh 3.528g of 3,3'-amidobis-o-cyclohexyltetracarboxylic dianhydride monomer and add it to the above solution in batches under stirring conditions, stir at 40°C for 4h, and obtain a polyamic acid solution through polycondensation reaction;

[0040] (2) Add catalyst triethylamine 3.036g and dehydrating agent acetic anhydride 3.063g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0041] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-expansion polyimide film.

[0042]The properties of the obtained polyimide film were character...

Embodiment 2

[0044] Prepare high transparency and low expansion polyimide film according to the following method:

[0045] (1) Add 2.253g 2-(4-amino-phenyl)-benzoxazol-5-amine diamine monomer into a four-necked flask containing 25.04gDMAc, under nitrogen protection, stir to dissolve it; weigh Get 1.764g3,3'-amidobis-o-cyclohexyltetracarboxylic dianhydride and 2.243g6FDA (3,3'-amidobis-o-cyclohexyltetracarboxylic dianhydride and 6FDA molar ratio is 1:1), stirring Add to the above solution in batches under certain conditions, stir at 40°C for 4 hours, and obtain a polyamic acid solution through polycondensation reaction;

[0046] (2) Add catalyst triethylamine 3.036g and dehydrating agent acetic anhydride 3.063g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0047] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-expan...

Embodiment 3

[0050] Prepare high transparency and low expansion polyimide film according to the following method:

[0051] (1) Add 2.253g 2-(4-amino-phenyl)-benzoxazol-5-amine diamine monomer into a four-necked flask containing 24.28gDMAc, under nitrogen protection, stir to dissolve it; weigh Get 2.470g3,3'-amidobis-o-cyclohexyltetracarboxylic dianhydride and 1.346g6FDA (the molar ratio of 3,3'-amidobis-o-cyclohexyltetracarboxylic dianhydride to 6FDA is 7:3), stir Add to the above solution in batches under certain conditions, stir at 40°C for 4 hours, and obtain a polyamic acid solution through polycondensation reaction;

[0052] (2) Add catalyst triethylamine 3.036g and dehydrating agent acetic anhydride 3.063g to the above polyamic acid solution for chemical imidization, stir at 40°C for 8h to obtain a polyimide solution;

[0053] (3) The obtained polyimide solution was cast on ultra-flat glass, and then dried in an oven at 100° C. for 24 hours to obtain a highly transparent and low-exp...

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Abstract

The invention belongs to the technical field of polyimide films, and particularly relates to a high-transparency low-expansion polyimide film material and a preparation method thereof. The high-transparency low-expansion polyimide film is obtained by polycondensation of a diamine monomer and a dianhydride monomer, the diamine monomer comprises nitrogen-containing aromatic diamine R1, and the dianhydride monomer comprises 3,3'-acylaminobis-o-cyclohexyl tetracarboxylic dianhydride Ar1; wherein the 3,3'-acylaminobis-o-cyclohexyl tetracarboxylic dianhydride Ar1 is obtained by introducing an acylamino group into 2,2',3,3'-biphenyl tetracarboxylic dianhydride and then performing hydrogenation. The high-transparency low-expansion polyimide film disclosed by the invention has the advantages of favorable light transmittance, lower expansion coefficient and excellent heat resistance, and is suitable for a flexible display cover plate; the invention also provides a preparation method thereof.

Description

technical field [0001] The invention belongs to the technical field of polyimide films, and in particular relates to a highly transparent and low-expansion polyimide film material and a preparation method thereof. Background technique [0002] At present, the flat panel display equipment market continues to expand, and there is a jumping demand for highly transparent polyimide (PI) for flexible display covers. In 2019, the demand for highly transparent polyimide is 45,000 square meters, and it is expected to reach 450,000 square meters in 2022. rice. However, the light transmittance of traditional aromatic polyimides in the visible light region is characteristic yellow, which cannot meet the high transparency requirements of optoelectronic display substrate materials, and the coefficient of thermal expansion (CTE) of ordinary polyimides is between 35 and It is about 80ppm / °C, which cannot meet the requirement that the expansion coefficient is less than 15ppm / °C in the high-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10
CPCC08J5/18C08G73/1078C08G73/1085C08G73/1007C08G73/1067C08G73/1039C08J2379/08
Inventor 王汉利王俊莉顾萍杨振东张敬
Owner SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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