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System and method for chemical mechanical planarization

A chemical mechanical and planarization technology, applied in the direction of grinding machine tools, manufacturing tools, grinding/polishing equipment, etc., can solve the impact of equipment failure, semiconductor wafer damage and other problems

Pending Publication Date: 2022-07-01
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chemical mechanical planarization, while very beneficial, is also susceptible to equipment failure, which can lead to semiconductor wafer damage

Method used

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  • System and method for chemical mechanical planarization
  • System and method for chemical mechanical planarization
  • System and method for chemical mechanical planarization

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Embodiment Construction

[0055] In the following description, a number of thicknesses and materials are described for various layers and structures within an integrated circuit die. For the various embodiments, specific dimensions and materials are given by way of example. Based on the present disclosure, those skilled in the art will recognize that other dimensions and materials may be used in many situations without departing from the scope of the present disclosure.

[0056] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific embodiments of elements and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to be limiting. For example, in the following description forming a first feature over or over a second feature may include embodiments in which the first and second features are formed in direct contact, and may also include em...

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Abstract

The invention provides a chemical mechanical planarization system and method. The chemical mechanical planarization system includes a chemical mechanical planarization pad that rotates during a chemical mechanical planarization process. The chemical mechanical planarization head contacts the semiconductor wafer with the chemical mechanical planarization pad during the process. The slurry supply system supplies slurry to the pad during the process. The pad adjuster adjusts the pad during the process. A suction system removes pad conditioner debris and slurry from the pad.

Description

technical field [0001] The present disclosure relates to the field of chemical mechanical planarization. Background technique [0002] There is an ever-increasing need for increased computing power in electronic devices, including smartphones, tablet computers, desktop computers, laptop computers, and many other types of electronic devices. Integrated circuits provide computing power for these electronic devices. One approach to increasing the computing power of integrated circuits is to increase the number of transistors and other integrated circuit features in a given area of ​​semiconductor substrates. Accordingly, many semiconductor processes and techniques have been developed to reduce the size of features in integrated circuits. [0003] Chemical mechanical planarization is a process that allows the use of thin film materials that enable relatively small size features. Chemical mechanical planarization can planarize the surface of semiconductor wafers after thin fil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/306H01L21/67
CPCH01L21/30625H01L21/67092B24B37/042B24B57/02
Inventor 许峻维
Owner TAIWAN SEMICON MFG CO LTD