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Power module and power module assembly with clamping feature

A technology for power modules and clamping components, which is applied in the direction of electrical components, semiconductor devices, and electric solid-state devices, and can solve the problems of time-consuming installation of power modules, increased manufacturing costs of base plates and power modules, etc.

Pending Publication Date: 2022-07-05
DANFOSS SILICON POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, providing a fixed part significantly increases the cost of manufacturing the baseplate and power module
Further, each power module needs to be provided with several fixing parts to securely mount the power module to the substrate, and therefore, it is time-consuming to install the power module

Method used

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  • Power module and power module assembly with clamping feature
  • Power module and power module assembly with clamping feature
  • Power module and power module assembly with clamping feature

Examples

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Embodiment Construction

[0038] Exemplary embodiments of the present disclosure will be described in detail hereinafter with reference to the accompanying drawings, wherein like reference numerals refer to like elements. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will be within the skill of the art Persons fully convey the concepts of this disclosure.

[0039] image 3 and Figure 4 A power module in an embodiment of the present disclosure is shown. The power module 200 includes a base plate 210 , electronic components 230 mounted on a top surface of the base plate 210 , and a body 220 encapsulating the electronic components 230 and the base plate 210 . like image 3 and Figure 4As shown, a portion of the top surface of the base plate is exposed from the body 220 and thus accessible from the outside. ...

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PUM

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Abstract

A power module (200) is disclosed. The power module (200) comprises: a base plate (210); an electronic component (230) mounted on a top surface of the base plate (210); and a main body (220) that encapsulates the electronic component (230) and the base plate (210). The main body (220) is configured or designed such that a portion of the top surface of the base plate (210) is accessible from the outside. A power module assembly comprising at least one power module (200) is also disclosed. The power module assembly further comprises: a substrate (400) on which the power module (200) is disposed; and at least one clamping device (300) configured for clamping on a portion of the top surface of the base plate (210) and fixing the power module (200) to the substrate (400).

Description

[0001] This application is a part of the invention patent application with the application number 201880057326.4 (the international application number is PCT / EP2018 / 073885) submitted on September 5, 2018, and the invention-creation title is "power module and power module assembly with clamping feature" case application. technical field [0002] The present disclosure relates to an electrical device and, in particular, to a power module having a clamping feature, a power module assembly, and an electrical device including the power module. Background technique [0003] Customers are increasingly demanding electrical and mechanical requirements for industrial and automotive applications. Power modules are used in different kinds of electrical installations. In electrical installations such as inverters, there is less and less space for molding power modules. [0004] Conventionally, the power module is fixedly mounted on the substrate by means of fixing members such as screw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/07H01L25/11H01L25/16H01L25/18H01L23/31H01L23/498
CPCH01L25/072H01L25/115H01L25/18H01L25/16H01L23/49844H01L23/3121H01L2924/13055H01L2924/19105H01L2924/13091H01L2924/3511
Inventor 霍尔格·比尔拉尔斯·保罗森
Owner DANFOSS SILICON POWER
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