Unlock instant, AI-driven research and patent intelligence for your innovation.

Exposure method and exposure device

An exposure method and a photomask technology, which are applied in the direction of photolithography exposure devices, valve devices, microlithography exposure equipment, etc., can solve problems such as inability to connect photomasks and substrates, complexity, insufficient gasket installation, etc.

Inactive Publication Date: 2006-07-19
SANEI GIKEN
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] However, when using substrates of different dimensions (length, width, and thickness), it is necessary to replace the spacer with the appropriate size for the substrate
It's a lot of work
In addition, if the spacer is not selected properly, or the installation of the spacer is not sufficient, the photomask and the substrate cannot be fully bonded, which will cause defective products in the exposure process.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Exposure method and exposure device
  • Exposure method and exposure device
  • Exposure method and exposure device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] figure 1 A schematic diagram of an embodiment of the exposure apparatus of the present invention is shown in . The exposure apparatus includes a substrate holding table 12 for holding a substrate 11 on which a photosensitive layer is formed on the surface, an annular sealing member 13 mounted on the substrate holding table 12, and a pressure control mechanism. The pressure control mechanism has: pressure sources 14 and 15; passages 16, 17, 18, and 19 extending from these pressure sources; pressure regulators 20 and 21 respectively arranged on passages 16 and 17; used to control these pressure adjustments The control device 22 of the devices 20 and 21. The pressure control mechanism may also have three-way valves 23 and 24 provided on channels 16 and 17, respectively. The structure of the substrate holding table 12 and the ring-shaped sealing member 13 and figure 2 and image 3 The substrate support table 2 and the sealing member 3 shown in are the same.

[0029] A p...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An exposure device has a substrate support base 2 for supporting the substrate 1 and a hollow seal member 13 which extends surrounding the circumference of the substrate 2. The photomask 6 is mounted on the seal member 13. A 1st space 27 surrounded with the photomask 6 is formed with the substrate support base 2 and seal member 13. A second space 28 is formed in the inside of the hollow seal member 13. When information regarding the size of the substrate 1 is inputted to control means 22 and 29, the first space 27 and a 2nd space 28 are applied with pressure according to the information. The value of the pressure is properly determined so that the photomask 6 comes into uniform contact with the entire surface of the substrate 1.

Description

technical field [0001] The invention relates to an exposure method and an exposure device for closely arranging a patterned photomask and a substrate with a photosensitive layer formed on its surface, and irradiating light to the substrate through the photomask, thereby transcribing the pattern on the substrate. Background technique [0002] For example, the surface of a substrate such as a printed circuit substrate is not necessarily flat. In order to accurately transfer the pattern drawn on the photomask to such an uneven substrate surface, it is necessary to uniformly adhere the photomask to the entire substrate surface. Therefore, conventionally, a method and an apparatus for setting the space between the photomask and the substrate to a negative pressure so as to bring them into close contact have been commonly used. [0003] figure 2 and image 3 This kind of conventional exposure apparatus is shown. The exposure apparatus includes a substrate holder 2 for supporti...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H01L21/027H01L21/68
CPCF16K5/06F16K27/067F16K31/041F16K31/602
Inventor 三宅荣一
Owner SANEI GIKEN