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Apparatus and method for picking element image and mounting apparatus for the element

一种图像拾取设备、图像拾取装置的技术，应用在电气元件、图像通信、电气元件等方向，能够解决妨碍成像、照明设备干扰等问题，达到避免通信延迟的效果

Inactive Publication Date: 2007-04-04
PANASONIC CORP
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] On the other hand, if image pickup is done using multiple cameras and preparing multiple lighting devices at a time, in this case, for example, for a setup where the interval of pump nozzles is as short as 10.75mm pitch, the light from each lighting device will interfere with each other, thus preventing normal imaging

Method used

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  • Apparatus and method for picking element image and mounting apparatus for the element
  • Apparatus and method for picking element image and mounting apparatus for the element
  • Apparatus and method for picking element image and mounting apparatus for the element

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Embodiment Construction

[0046] As embodiments of the present invention, a component image pickup apparatus, a component image pickup method, and a component mounting apparatus will be described below with reference to the drawings. The component image pickup method is a method performed by a component image pickup device, and the component mounting device includes the component image pickup device. In the drawings, the same parts are indicated by the same reference numerals throughout.

[0047] As shown in FIGS. 1 and 2, the component image pickup apparatus includes an image pickup camera 110 equipped with a plurality of image pickup devices 111, a single lighting device 112, and an image pickup controller 115 having a sequencer (sequencer) 113 and a memory 114. etc., as the basic components. The component image pickup device may include a recognizer 150 connected to the image pickup camera 110 . The interface 116 of the image pickup camera 110 constitutes a connection portion with the recognizer 1...

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Abstract

An image pickup camera 10 is arranged, so that a plurality of components 251 are adapted to be sequentially imaged by corresponding image pickup device 111 with a timing whereby light for imaging is prevented from affecting the other image pickup operation while the components are let to pass above the image pickup camera. The hold posture of each of the plurality of components can be imaged separately without decreasing the cycle time.

Description

technical field [0001] The present invention relates to an image pickup method for electronic components to be mounted on, for example, a printed circuit board, a component image pickup apparatus for performing the image pickup method, and a component mounting apparatus using the component image pickup apparatus. Background technique [0002] In recent years, in order to increase the productivity of the electronic component mounting process, there is a strong need to improve the reliability of the workflow and shorten the cycle time. Generally, in mounting equipment for mounting electronic components such as chip components and IC components on circuit boards, an image pickup device such as a CCD camera is used to pick up and hold the electronic components and mount the components on the circuit board The suction posture of the electronic components on the pump nozzle. The suction state, suction position, and the like can be recognized based on the picked-up image, and the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04G01N21/956H04N5/222H05K13/08
CPCG01N21/95684H05K13/0413H05K13/0812
Inventor 王生和宏光本丰蜂谷荣一植田秀司
Owner PANASONIC CORP
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