Chip delivery device , method of taking out chip and holding chip
A transmission device and substrate technology, applied in the direction of conveyor objects, transportation and packaging, packaging item types, etc., can solve problems such as inefficient work, large work space, complex devices, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0044] Hereinafter, the present invention will be described by way of illustrated examples with reference to the accompanying drawings.
[0045] figure 1 is a plan view illustrating the substrate containing tray 10 used in the present invention. figure 2 is a perspective view of the substrate holding tray 10, image 3 is along figure 1 A partial cross-sectional view of the substrate holding tray 10 taken along the line A-A. The substrate accommodating tray 10 is very useful for accommodating glass substrates used for, for example, liquid crystal display panels; in particular, for conveying and storing glass substrates having a side length of 1.3 m or more and a thickness of 0.7 mm or less. According to the substrate transfer device 30 of the present invention ( Figure 5 ) is used to take out the glass substrate 20 from the substrate holding tray 10, for example.
[0046] The substrate holding tray 10 is molded into a thin cuboid. The substrate accommodating tray 10 inc...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 