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Multilayer substrate module and wireless portable terminal

A multi-layer substrate and wiring technology, which is applied in multi-layer circuit manufacturing, electrical components, electric solid-state devices, etc., can solve the problems of damaging the quadrature precision of the quadrature mixer and the orthogonality of the mixer

Inactive Publication Date: 2004-12-29
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0041] That is, if Figure 25 As shown, for example, the ground current Igrd that flows into the ground node 20 from the first mixer 410a flows into the second mixer 410b along the current path indicated by a dotted line due to the influence of the parasitic inductance Lgrd of the main ground wiring 150. , potentially compromising the orthogonality of the 2 mixers
Due to the adverse effects of such inflow current Igrd', such as Figure 26 As shown, there will be an amplitude error ΔA or a phase error Δφ between the baseband signals BBI and BBQ, which will damage the quadrature accuracy of the quadrature mixer.

Method used

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  • Multilayer substrate module and wireless portable terminal
  • Multilayer substrate module and wireless portable terminal
  • Multilayer substrate module and wireless portable terminal

Examples

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Embodiment Construction

[0079]Hereinafter, a multilayer substrate module according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same symbols are shown on the same or corresponding parts in the drawings, and description thereof will not be repeated.

[0080] (Embodiment 1)

[0081] refer to figure 1 , the multilayer substrate module 110 according to Embodiment 1 of the basic invention is mounted on the main board 10 . Although not shown in detail, a plurality of wiring patterns are formed on the main board 10, and by electrically connecting these wiring patterns to, for example, signal transfer nodes 202 provided as pin terminals, the main board 10 and the multilayer substrate module 110 formed in Electrical signals can be sent and received between internal circuits.

[0082] refer to figure 2 , the multilayer substrate module 110 receives the supply of the reference potential Vss by being connected to the ground node 20 p...

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Abstract

In the present invention, a plurality of earth lines corresponding to a plurality of interior circuits are arranged in the multi-layer substrate modules of the reference potential (Vss) for receiving ground-engaging from external earth points, common nodes (Ncmn) for connecting ground connection lines are arranged in the insulating layer of the multi-layered substrate module, which is connected with the earth engaging nodes through the common earth terminals between a plurality of interior circuits, thus the internal flow of earth-current between a plurality of interior circuits can be prevented and the operation can be stabilized.

Description

[0001] This application is a divisional application of: [0002] Invention title: "Multilayer Substrate Module and Wireless Portable Terminal" [0003] The application date is: June 29, 2000 [0004] The application number is: 00812234.2 (PCT / JP00 / 04305) technical field [0005] The present invention relates to a multilayer substrate module, and more specifically, to a multilayer substrate module forming an electronic circuit operating in a high-frequency region, and a wireless terminal device including a circuit mounted on the multilayer substrate module. Background technique [0006] In recent years, electronic devices have been reduced in size and weight, and circuit boards used in electronic devices have also been developed to be smaller, lighter, thinner, and more complex in accordance with this trend. In particular, in wireless communication devices using high frequencies represented by mobile phones, multilayer substrates using ceramics are being used due to the exc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H03D7/00H05K3/46
Inventor 桂隆俊伊东健治永野弘明义田阳次下泽充弘高木直末松宪治小野政好前田宪一
Owner MITSUBISHI ELECTRIC CORP
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