Multilayer substrate module and wireless portable terminal
A technology of multi-layer substrate and insulating layer, applied in the direction of multi-layer circuit manufacturing, structural connection of printed circuit, printed circuit components, etc. And other issues
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[0079]Hereinafter, a multilayer substrate module according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same reference numerals are shown in the same or corresponding parts in the drawings, and the description thereof will not be repeated.
[0080] (Embodiment 1)
[0081] Refer to figure 1 , The multilayer substrate module 110 of the first embodiment of the basic invention is mounted on the main board 10. Although not shown in detail, a plurality of wiring patterns are formed on the main board 10, and by electrically connecting these wiring patterns to the signal transmission nodes 202 provided as pin terminals, for example, the main board 10 and the multilayer board module 110 are formed The internal circuits can send and receive electrical signals.
[0082] Refer to figure 2 The multilayer substrate module 110 receives the supply of the reference potential Vss through the connection with the ground node ...
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