Check patentability & draft patents in minutes with Patsnap Eureka AI!

Multilayer substrate module and wireless portable terminal

A technology of multi-layer substrate and insulating layer, applied in the direction of multi-layer circuit manufacturing, structural connection of printed circuit, printed circuit components, etc. And other issues

Inactive Publication Date: 2004-12-29
MITSUBISHI ELECTRIC CORP
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0041] That is, if Figure 25 As shown, for example, the ground current Igrd that flows into the ground node 20 from the first mixer 410a flows into the second mixer 410b along the current path indicated by a dotted line due to the influence of the parasitic inductance Lgrd of the main ground wiring 150. , potentially compromising the orthogonality of the 2 mixers
Due to the adverse effects of such inflow current Igrd', such as Figure 26 As shown, there will be an amplitude error ΔA or a phase error Δφ between the baseband signals BBI and BBQ, which will damage the quadrature accuracy of the quadrature mixer.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer substrate module and wireless portable terminal
  • Multilayer substrate module and wireless portable terminal
  • Multilayer substrate module and wireless portable terminal

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0079]Hereinafter, a multilayer substrate module according to an embodiment of the present invention will be described in detail with reference to the drawings. In addition, the same reference numerals are shown in the same or corresponding parts in the drawings, and the description thereof will not be repeated.

[0080] (Embodiment 1)

[0081] Refer to figure 1 , The multilayer substrate module 110 of the first embodiment of the basic invention is mounted on the main board 10. Although not shown in detail, a plurality of wiring patterns are formed on the main board 10, and by electrically connecting these wiring patterns to the signal transmission nodes 202 provided as pin terminals, for example, the main board 10 and the multilayer board module 110 are formed The internal circuits can send and receive electrical signals.

[0082] Refer to figure 2 The multilayer substrate module 110 receives the supply of the reference potential Vss through the connection with the ground node ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In the present invention, a plurality of earth lines corresponding to a plurality of interior circuits are arranged in the multi-layer substrate modules of the reference potential for receiving ground-engaging from external earth points, common nodes (Ncmn) for connecting ground connection lines are arranged in the insulating layer of the multi-layered substrate module, which is connected with the earth engaging nodes through the common earth terminal 204 between a plurality of interior circuits, the nodes are preferably arranged in the insulating layer on the lowest layer of the multilayer substrate module. By applying the invention, the internal flow of earth-current between a plurality of interior circuits can be prevented.

Description

[0001] This application is a divisional application of the following applications: [0002] Invention Title: "Multilayer substrate module and wireless portable terminal" [0003] Application date: June 29, 2000 [0004] The application number is: 00812234.2 (PCT / JP00 / 04305) Technical field [0005] The present invention relates to a multilayer substrate module. More specifically, it relates to a multilayer substrate module formed with an electronic circuit that operates in a high-frequency region, and a wireless terminal device equipped with a circuit mounted on the multilayer substrate module. Background technique [0006] In recent years, electronic equipment has been developing towards size and weight, and circuit boards used in electronic equipment have also been developed to be smaller, lighter, thinner, and more complex in a form that matches this trend. In particular, in wireless communication devices that utilize high frequencies, such as mobile phones, based on the excell...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L25/00H03D7/00H05K1/14H05K3/46
Inventor 桂隆俊伊东健治永野弘明义田阳次下泽充弘高木直末松宪治小野政好前田宪一
Owner MITSUBISHI ELECTRIC CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More