Unlock instant, AI-driven research and patent intelligence for your innovation.

Substrate treating apparatus

a technology of substrate and treating apparatus, which is applied in the direction of chemistry apparatus and processes, cleaning processes and apparatus, and cleaning using liquids, etc., can solve the problems of high aspect ratio, difficult to dry sufficiently deionized water entering the gaps of the structure, and unsatisfactory drying performance, etc., to achieve the effect of increasing the removal ra

Inactive Publication Date: 2008-10-02
DAINIPPON SCREEN MTG CO LTD
View PDF8 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention is a substrate treating apparatus that aims to reduce unsatisfactory drying of substrates and collapse of fine structures caused by deionized water in the treating liquid. It achieves this by minimizing the concentration of deionized water in the treating liquid by reducing the amount of deionized water in the inner tank of the treating tank and replacing it with a solvent. The apparatus includes a separating device for separating deionized water and solvent, an adsorbing and removing device for removing deionized water, and a control device for carrying out a deionized water cleaning process and a replacing process. The apparatus can also include a mixer for mixing deionized water and solvent, and a cooling device for cooling the filter. The technical effects of this invention include improved substrate drying and reduced collapse of fine structures caused by deionized water in the treating liquid.

Problems solved by technology

However, deionized water adhering to fine patterns formed on the substrates cannot be dried sufficiently, and thus a possibility of unsatisfactory drying performance.
Such a cylindrical structure has a very high aspect ratio, and it is particularly difficult to dry sufficiently deionized water having entered gaps of that structure.
A similar problem can occur also with devices related to what is known as MEMS (Micro Electro Mechanical Systems).
In this case, however, although it is important to replace the deionized water with the solvent sufficiently, the concentration of deionized water in the solvent cannot be reduced below a certain level even if a large quantity of solvent is mixed into the deionized water.
The solvent cannot replace the deionized water sufficiently.
Thus, there still is a possibility of unsatisfactory drying performance due to the deionized water.
Thus, there still is a possibility of unsatisfactory drying performance due to the deionized water.
In addition, when the substrates are pulled up, the fine structures could collapse due to the surface tension of the deionized water.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate treating apparatus
  • Substrate treating apparatus
  • Substrate treating apparatus

Examples

Experimental program
Comparison scheme
Effect test

embodiment 1

[0047]FIG. 1 is a block diagram showing an outline of a substrate treating apparatus in Embodiment 1.

[0048]A treating tank 1 includes an inner tank 3 and an outer tank 5. The inner tank 3 stores a treating liquid or solution, and can receive wafers W held by a holding arm 7. The holding arm 7 includes support elements arranged on lower positions of an arm portion for contacting lower edges of the wafers W and supporting the wafers W in upstanding posture. The holding arm 7 is vertically movable between a treating position inside the inner tank 3 and a standby position above the inner tank 3. The inner tank 3 stores deionized water, solvents or a mixture thereof as a treating liquid or solution, and the treating liquid overflowing the inner tank 3 is collected in the outer tank 5 surrounding an upper portion of the inner tank 3. The inner tank 3 has two jet pipes 9 disposed at opposite sides in the bottom thereof for supplying the treating liquid into the inner tank 3.

[0049]The jet p...

embodiment 2

[0094]FIG. 6 is a block diagram showing an outline of a substrate treating apparatus in Embodiment 2.

[0095]A treating tank 1 includes an inner tank 3 and an outer tank 5. The inner tank 3 stores a treating liquid or solution, and can receive wafers W held by a holding arm 7. The holding arm 7 includes support elements arranged on lower positions of an arm portion for contacting lower edges of the wafers W and supporting the wafers W in upstanding posture. The holding arm 7 is vertically movable between a “treating position” inside the inner tank 3 and a “standby position” above the inner tank 3. The inner tank 3 stores deionized water, solvents or a mixture thereof as a treating liquid or solution, and the treating liquid overflowing the inner tank 3 is collected in the outer tank 5 surrounding an upper portion of the inner tank 3. The inner tank 3 has two jet pipes 9 disposed at opposite sides in the bottom thereof for supplying the treating liquid into the inner tank 3.

[0096]The j...

embodiment 3

[0137]FIG. 10 is a block diagram showing an outline of a substrate treating apparatus in Embodiment 3.

[0138]The substrate treating apparatus in this embodiment includes a treating tank 1. The treating tank 1 includes an inner tank 3 and an outer tank 5. The inner tank 3 stores a treating liquid or solution, and can receive wafers W held by a holding arm 7. The holding arm 7 includes support elements arranged on lower positions of an arm portion for contacting lower edges of the wafers W and supporting the wafers W in upstanding posture. The holding arm 7 is vertically movable between a “treating position” inside the inner tank 3 and a “standby position” above the inner tank 3. The inner tank 3 stores deionized water, solvents or a mixture thereof as a treating liquid or solution, and the treating liquid overflowing the inner tank 3 is collected in the outer tank 5 surrounding an upper portion of the inner tank 3. The inner tank 3 has two jet pipes 9 disposed at opposite sides in the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A substrate treating apparatus for treating substrates with a treating liquid includes a treating tank having an inner tank for storing the treating liquid, and an outer tank for collecting the treating liquid overflowing the inner tank. A supply pipe interconnects the inner tank and the outer tank for circulating the treating liquid. A first branch pipe is shunted from the supply pipe, and a separator is mounted on the first branch pipe for separating deionized water and a solvent in the treating liquid, and discharging the deionized water. A second branch pipe interconnects positions upstream and downstream of the separator, and a deionized water remover is mounted on the second branch pipe for adsorbing and removing deionized water from the treating liquid. An injection pipe is connected to the supply pipe for injecting deionized water in a position downstream of the separator. A solvent injector injects the solvent into the injection pipe. A controller carries out a deionized water cleaning process for supplying deionized water from the injection pipe and cleaning the substrates inside the cleaning tank with deionized water, then a replacing process for injecting the solvent from the solvent injector and replacing the deionized water with the solvent, a separating and removing process for switching to the first branch pipe and causing the separator to remove the deionized water from the treating liquid, and an adsorbing and removing process for switching to the second branch pipe and causing the deionized water remover to adsorb and remove the deionized water from the treating liquid.

Description

BACKGROUND OF THE INVENTION[0001](1) Field of the Invention[0002]This invention relates to substrate treating apparatus for treating, e.g. cleaning, substrates such as semiconductor wafers or glass substrates for liquid crystal displays (hereinafter called simply substrates) with a treating liquid.[0003](2) Description of the Related Art[0004]Conventionally, this type of apparatus includes, for example, a treating tank for storing a treating liquid and receiving substrates, and a nozzle for supplying isopropyl alcohol (IPA) gas to a space above the treating tank (see Japanese Unexamined Patent Publication H10-22257, for example). With this apparatus, after supplying deionized water to the treating tank and cleaning substrates, IPA gas is supplied to the space above the treating tank to form an IPA atmosphere therein. By pulling up and moving the substrates in the IPA atmosphere, the deionized water adhering to the substrates is replaced with IPA to promote drying of the substrates.[...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B08B3/08B08B3/12
CPCH01L21/67057H01L21/67086H01L21/304
Inventor KIMURA, MASAHIROTAKAHASHI, HIROAKIMAEGAWA, TADASHIHAYASHI, TOYOHIDE
Owner DAINIPPON SCREEN MTG CO LTD