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Heat dissipation assembly for electronic device

a technology for electronic devices and heat dissipation parts, which is applied in lighting and heating apparatus, ventilation systems, heating types, etc., can solve the problems of significant heat dissipation problems and reduce the efficiency of heat dissipation by the server

Inactive Publication Date: 2012-11-15
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a heat dissipation assembly for electronic devices, particularly servers. The technical problem addressed by the invention is the inefficient heat dissipation caused by the mismatch of heat sinks and airflow guides in servers, which can result in decreased efficiency of heat dissipation. The invention provides a solution by integrating the heat sinks with the airflow guide, allowing for better heat dissipation. The invention includes an airflow guide with a top wall and airflow guide components that guide air into the heat sinks and enhance heat dissipation. The invention improves the heat dissipation assembly for electronic devices and ensures better performance of the devices.

Problems solved by technology

Heat dissipation is a significant problem in the research and development of electrical devices, for example, servers.
When the height of a heat sink does not match the height of an airflow guide, part of the air flowing through an airflow guide may flow out without passing through the heat sink, thus decreasing the efficiency of heat dissipation by the server.

Method used

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  • Heat dissipation assembly for electronic device
  • Heat dissipation assembly for electronic device
  • Heat dissipation assembly for electronic device

Examples

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Embodiment Construction

[0013]Referring to FIG. 1, an embodiment of a heat dissipation assembly 20 is shown. The heat dissipation assembly 20 is configured to be mounted on a circuit board 22. The heat dissipation assembly 20 includes heat sinks 24 for absorbing and dissipating heat generated by electrical components mounted on the circuit board 22, and an airflow guide 10.

[0014]Referring to FIGS. 2-6, the airflow guide 10 includes a top wall 11, a first sidewall 12, a second sidewall 13, a third sidewall 14, and two airflow guide components 15. The top wall, the first sidewall 12, and the second sidewall 13 cooperatively form a first air passage 16. The first air passage 16 includes a first air inlet 162 and a first air outlet 161. One of the heat sinks 24 is disposed in the first air passage 16 (described later). Moving air goes into the first air passage 16 via the first air inlet 162, and goes out through the first air outlet 161, thus carrying heat away from the heat sink 24. The top wall, the second ...

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PUM

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Abstract

A heat dissipation assembly includes a heat sink and an airflow guide. The airflow guide includes a top wall, two sidewalls connected to the top wall, and an airflow guide component mounted on an inner surface of the top wall. The top wall and the two sidewalls cooperatively define an air passage for allowing air to flow through. The heat sink is disposed in the air passage and the airflow guide component is configured to guide air through the air passage to the heat sink.

Description

BACKGROUND[0001]1. Technical Field[0002]The present disclosure relates to a heat dissipation assembly for an electronic device.[0003]2. Description of Related Art[0004]Heat dissipation is a significant problem in the research and development of electrical devices, for example, servers. When CPUs of different calorific values are used in a server, heat sinks of different sizes are used to dissipate heat generated by the CPU. When the height of a heat sink does not match the height of an airflow guide, part of the air flowing through an airflow guide may flow out without passing through the heat sink, thus decreasing the efficiency of heat dissipation by the server.[0005]Therefore, it is desirable to provide a heat dissipation assembly which can overcome the above-mentioned limitations.BRIEF DESCRIPTION OF THE DRAWINGS[0006]FIG. 1 is a perspective view of a heat dissipation assembly in accordance with an embodiment, together with a circuit board.[0007]FIG. 2 is a perspective view of a...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F24F13/02
CPCH05K7/20154H05K7/20145
Inventor LIU, LEI
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD