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Heat pipe with flexible support structure

Inactive Publication Date: 2012-12-27
CELSIA TECH TAIWAN INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the computing speed of a central processing unit (CPU) of a computer becomes increasingly faster, the heat generated by the CPU becomes increasingly higher, and conventional heat dissipating device comprised of an extruded aluminum heat sink and a fan no longer can meet the requirements of the present CPUs, and thus related manufacturers keep on developing heat pipes or vapor chambers with a higher thermal conductivity and combine the heat pipe or vapor chamber with the heat sink to overcome the heat dissipating problem effectively.
Most supports are generally formed to fit the length of the pipe body of the heat pipe and do not have the bendable feature, such that after the support is installed in the heat pipe, the bent pipe or the support of the bent pipe may be damaged easily.

Method used

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  • Heat pipe with flexible support structure
  • Heat pipe with flexible support structure
  • Heat pipe with flexible support structure

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Embodiment Construction

[0011]The technical characteristics and contents of the present invention will become apparent with the following detailed description and related drawings. The drawings are provided for the purpose of illustrating the present invention only, but not intended for limiting the scope of the invention.

[0012]With reference to FIGS. 1 and 2 for an exploded view and a cross-sectional view of a heat pipe with a flexible support structure in accordance with the present invention respectively, a flexible support is installed inside the heat pipe, such that the heat pipe can be bent and applied for different applications, and the support assures that the capillary structure or the bent pipe have sufficient support, and the heat pipe is comprised of a pipe body 1 and a support 2.

[0013]The pipe body 1 is made of a good thermal conductive material such as copper or aluminum, and the pipe body 1 is hollow. In this preferred embodiment of the present invention, the pipe body 1 is in a flat shape a...

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Abstract

A heat pipe with a flexible support structure includes a pipe body and a support, and the support is installed in the pipe body and includes a first row of side plates and a second row of side plates extended along the lengthwise direction of the pipe body and a plurality of support elements coupled between the first and second rows of side plates, and each support element abuts the internal side of a capillary tissue of the pipe body. Plate elements of the first and second rows of side plates are arranged with an interval apart from each other and in sections along the lengthwise direction of the pipe body, and the plate elements of the first row of side plates and the plate elements of the second row of side plates are aligned alternately with each other. The support is flexible to facilitate users to bend the heat pipe.

Description

FIELD OF THE INVENTION[0001]The present invention relates to a heat pipe, in particular to a heat pipe with a flexible support structure.BACKGROUND OF THE INVENTION[0002]As the computing speed of a central processing unit (CPU) of a computer becomes increasingly faster, the heat generated by the CPU becomes increasingly higher, and conventional heat dissipating device comprised of an extruded aluminum heat sink and a fan no longer can meet the requirements of the present CPUs, and thus related manufacturers keep on developing heat pipes or vapor chambers with a higher thermal conductivity and combine the heat pipe or vapor chamber with the heat sink to overcome the heat dissipating problem effectively.[0003]However, the conventional heat pipe usually comes with a support installed in the heat pipe to provide the adhesive strength for a capillary tissue or the supporting force for a pressed pipe body, when factors such as the adhesion of the capillary tissue and the negative pressure...

Claims

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Application Information

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IPC IPC(8): F28D15/04
CPCF28D15/046F28D15/0241
Inventor MEYER, IV, GEORGE ANTHONYSUN, CHIEN-HUNGCHEN, CHIEH-PINGCHIN, TE-HSUAN
Owner CELSIA TECH TAIWAN INC