Microchannel reactors and fabrication processes

Abstract

A microchannel reactor comprising: (a) a plurality of process microchannels having particulates packed along the length of the microchannels; (b) a plurality of heat transfer microchannels in thermal communication with the plurality of process microchannels; and, (c) a first retainer positioned at a first end of the plurality of process microchannels to inhibit the particulates from exiting the process microchannels via the first end.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application claims the benefit of U.S. Provisional Patent Application Ser. No. 61 / 509,469, entitled, “MICROCHANNEL REACTORS AND FABRICATION PROCESSES,” filed Jul. 19, 2011, the disclosure of which is hereby incorporated by reference.INTRODUCTION TO THE INVENTION[0002]The present disclosure is directed to conducting chemical processing applications in by manifolding streams to and from multiple parallel reactor modules and, more specifically, to conducting processing in multiple reactor modules within pressure containing assemblies which have been designed to facilitate maintenance, repair, and replacement of packed beds of solid materials. The present disclosure includes methods and devices particularly useful for construction and operation of multiple parallel chemical processing modules, each module comprising multiple distinct and separate process channels, such as microchannels, where each channel comprising packed beds of...

AI Technical Summary

Benefits of technology

The patent describes a new technology for microchannel devices that uses welding instead of bonding or brazing to secure the layers of the device to each other. This reduces costs and allows for larger manufacturing scales. The technology also includes the use of particulate materials, such as catalysts or heat transfer materials, within the microchannels. The patent also describes methods for removing and replacing the particulate materials. Overall, the technology provides a more cost-effective and efficient way to manufacture microchannel devices.

Problems solved by technology

It is believed that without bonding the entire exposed surfaces of the shim layers to one another, the microchannel device will not withstand normal or elevated operating pressures.

One of the problems addressed by the exemplary embodiments is reducing the amount of material and thus cost to contain high pressure fluids in welded microchannel reactors that are not internally sealed, such as by using bonding or brazing.

Additional problems addressed by the exemplary embodiments are: (a) the need to load solid particulate materials into multiple parallel and separate microchannels contained within a pressure vessel with sufficient uniformity to achieve desired packing density, without which the chemical processor may not achieve desired performance; (b) the need to provide a precise, repeatable catalyst loading process for multiple parallel and separate microchannels contained within a pressure vessel, (b) the need to need to unload solid particulate materials from multiple parallel microchannels contained within a pressure vessel in order to refresh the chemical processor with new materials; (c) the need to provide loading and unloading of solid materials using a densification apparatus that is placed within a pressure vessel and which enables loading of multiple parallel microchannels with sufficient uniformity; and, (d) the need to provide service to chemical processors located in the field at a plant or in a remote location by using a portable densification apparatus that is placed within a pressure vessel and which enables loading of solid materials with sufficient uniformity into multiple parallel microchannels contained within said pressure vessel.

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