Compute chassis having a lid that secures and removes air baffles

Abstract

A chassis includes a base, a lid, and air baffles disposed within the base. The lid slidably engages opposing base side walls and slides between secured and unsecured positions. In one embodiment, a mechanical latch attaches to the lid and has a spring-biased latch arm for selectively locking the lid to the base and a latch hook for selectively locking the air baffle to the lid, wherein depressing the mechanical latch releases the lid from the base and physically separating the lid from the base causes the latch hook to secure the air baffle for removing the air baffle along with the lid. In another embodiment, a first magnet is attached to the lid and a second magnet is attached to the air baffle, wherein sliding the lid to the unsecured position aligns the first and second magnets and magnetically couples the air baffle to the lid.

Description

BACKGROUND[0001]Field of the Invention[0002]The present invention relates to a computer chassis having a removable lid or cover.[0003]Background of the Related Art[0004]A compute node is commonly disposed in a chassis for multiple purposes, including facilitating safe handling of the components, containing electromagnetic interference, and controlling airflow across the components in order to provide adequate cooling. A fan or other air mover may be used to drawn airflow through the chassis, such that cool air is drawn in one end of the chassis and warmed air is exhausted from the opposite end of the chassis.[0005]Since some components within the chassis typically generate more heat than others and the performance of some components can be negatively affected by excessively high temperatures, the flow of cool air to certain components is more critical than the flow of cool air to other components. Providing a desired amount of airflow to a given heat-generating component, such as th...

AI Technical Summary

Benefits of technology

The present invention provides a chassis with a base, lid, and air baffles, where the lid can be securely locked to the base or separated from the base to remove the air baffle. The chassis also includes a mechanical latch for securely locking the lid and air baffle, and a magnetic coupling between the lid and air baffle. The technical effect is to provide a convenient and easy-to-use mechanism for attaching and removing the air baffle from the chassis.

Problems solved by technology

Since some components within the chassis typically generate more heat than others and the performance of some components can be negatively affected by excessively high temperatures, the flow of cool air to certain components is more critical than the flow of cool air to other components.

Providing a desired amount of airflow to a given heat-generating component, such as the processor, may be further affected by the presence or absence of adjacent components that can cause airflow restrictions or diversions.

Still further, a component that is directly downstream of a hot component may not be cooled at all by the warmed air passing over that component.

If the air baffle is removed, lost or positioned improperly, the performance of the computer system can be negatively affected.

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