4results about How to "Rapid divergence" patented technology

This utility model discloses a semiconductor packaging structure with a heat sink in a molded enclosure, including a frame body and a packaging module disposed on the frame body. The packaging module includes at least a molded enclosure carrying a heat sink, a chip, and bonding wires placed within the molded enclosure. The chip is mounted on the upper surface of the frame body, and the bonding wires electrically connect the chip and the frame body. The heat sink is disposed at the bottom of the molded enclosure, with several grooves formed on its upper surface and embedded within the molded enclosure, while its lower surface is exposed to the air outside the bottom of the molded enclosure. Compared with traditional molded enclosures containing only molding compound, this packaging structure provides an additional effective heat dissipation path by placing a heat sink on the surface of the molded enclosure, thereby improving the heat dissipation performance of the packaging structure. Furthermore, this packaging structure is simple in form, easy to manufacture, and low in cost, making it highly suitable for large-scale industrial production applications.

The utility model discloses a kind of heat dissipation mechanisms of intelligent temperature control PCBA board, it is related to PCBA board heat dissipation technical field, including heat conducting component and combined strut, it is characterized by: the bottom four diagonally of heat conducting component is vertically installed with combined strut, and the bottom end of combined strut is connected with support frame, and the bottom middle of support frame is installed with fan mechanism component, and fan mechanism component and heat conducting component are connected with sensing line between left and right symmetry. The heat dissipation mechanism of this intelligent temperature control PCBA board, by the structural setting of heat conducting component, cooperate the structural setting of fan mechanism component, can be according to the surface temperature of PCBA board Intelligent control is carried out, and good structure heat dissipation is realized, to this end guarantee the good operation of PCBA board, simultaneously cooperate the structural setting of combined strut, can heat conducting component be fixed in the top of support frame, and cooperate the structural characteristics of support frame itself, better structure fixation can be realized, to guarantee the structural stability of PCBA board.

This utility model relates to the field of permanent magnet synchronous motor technology, and in particular to a heat dissipation base for a permanent magnet synchronous motor. The base includes a permanent magnet synchronous motor body and a first heat sink. The first heat sink is located on the outer side of the permanent magnet synchronous motor body. In this utility model, by setting a heat-conducting plate, a second heat sink, a flow equalizing plate, a support frame, a cooling fan, an air inlet slot, and a filter plate, when the permanent magnet synchronous motor body is powered on, the support frame supports the cooling fan. The cooling fan is started by an external controller, causing it to rotate and allowing air to quickly enter the base body through the air inlet slot, accelerating air circulation. The flow equalizing plate ensures uniform air distribution, the heat-conducting plate conducts heat to the bottom of the permanent magnet synchronous motor body, and the second heat sink increases the heat dissipation area, allowing heat to dissipate quickly and flow out from the heat dissipation slot. This device enables the base body to have a heat dissipation function and improves the overall heat dissipation efficiency.

This application discloses a forced ventilation cooling DC converter, including a housing and a circuit board with electrical components, and a heat dissipation hole group disposed on the peripheral wall of the housing; a pair of opening and closing plates that can slide in the inner cavity of the housing; and an opening and closing actuation device for controlling the opening and closing of the pair of opening and closing plates. The heat dissipation hole group includes two rows of side holes symmetrically disposed on the front and rear side walls of the housing; and a pair of central holes symmetrically disposed on the left and right side walls of the housing. Each opening and closing plate moves along a direction parallel to the axis of the side holes. By adopting the above technical solution, in daily use, the opening and closing actuation device drives the pair of opening and closing plates to repeatedly open and close, thereby allowing external air to enter the inner cavity of the housing through the side holes and central holes, dissipate heat from the electrical components, and then be discharged.