Ultrasonic imaging device

Abstract

An ultrasonograph, an ultrasonic transducer, an inspection device, and an ultrasonic imaging device enabling easy and quick inspection and high-resolution or high-speed processing are provided. Barium titanate (BaTiO3) or lead zirconate titanate (PZT) is used for a piezoelectric material constituting the ultrasonic transducer, and the thickness thereof is 0.1 mum to 100 mum. Included therein are a drive section capable of driving an arbitrary one of piezoelectric layers, a detecting section detecting electrical signals generated by the plural piezoelectric layers based on echoes from an irradiation object, the echoes being originated from an ultrasonic wave generated by the driven piezoelectric layer, and a processing section performing processing for visualizing a state of the irradiation object based on the detected electrical signals.

Description

technical field [0001] The present invention relates to an ultrasonic imaging device that uses ultrasonic waves to detect internal defects and abnormalities such as peeling of semiconductor chips, metals, ceramic parts, resins, etc. Background technique [0002] Ultrasonic inspection of microscopic internal structures such as semiconductor chips (integrated circuits: ICs) is intended to detect the bonding state of solder bonding the functional surfaces of semiconductor chips and wiring boards and fillers filling gaps between them. [0003] One such detection method is as follows: while the monocular ultrasonic transducer is mechanically scanned in water, ultrasonic waves are irradiated from the transducer through the water to the detection object, and the ultrasonic wave that propagates through the detection object and becomes an echo return is detected using the above-mentioned transducer. Capture, process the resulting signal, and judge the state of the detection object. ...

AI Technical Summary

Problems solved by technology

[0004] This detection method has the following problems at the same time: the mechanical scanning immersed in water is laborious and time-consuming, and when detecting semiconductor chips, etc., the chips cannot be used after detection, and the connection terminal area of ​​the semiconductor chip to be detected is getting smaller and smaller, and the pitch It is getting narrower and narrower, and the abnormal judgment ability may be insufficient under the current detection accuracy

[0012] However, since the piezoelectric conversion element is immersed in liquid in the water immersion method, the liquid easily penetrates into the piezoelectric conversion element, reducing its durability.

And it is difficult to internally detect the object to be detected arranged in a closed container from the outside

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