Ultrasonic examining instrument

Abstract

The invention provides an ultrasonic detection device capable of simple and convenient detection, high resolution and high speed processing. The ultrasonic detection device of the present invention has: a laser light source, which generates laser light intermittently or with modulated intensity; an optical irradiation system, which makes the generated laser light irradiate the detection object in a point shape; a scanning movement mechanism, which makes the optical irradiation system relatively detect The scanning movement of the object; the vibration displacement detecting section, which utilizes a displacement measurement method using laser light, non-contactly detects the vibration displacement of the surface of the detection object, and converts it into an electric signal, and the vibration displacement of the detection object surface is detected by the irradiated laser The generated echo of the ultrasonic wave in the detection object is caused; and the processing part, which performs visualization processing on the state of the detection object according to the converted electrical signal and the position of the scanning optical irradiation system.

Description

[0001] The present invention is a divisional application of Chinese Patent Application No. 02802634.9, which entered the national phase on April 10, 2003, entitled "ultrasonic detection device, ultrasonic transducer, detection device, and ultrasonic imaging device". technical field [0002] The present invention relates to an ultrasonic testing device that uses ultrasonic waves to detect internal defects and abnormalities such as peeling of semiconductor chips, metals, ceramic parts, resins, etc. Background technique [0003] Ultrasonic inspection of microscopic internal structures such as semiconductor chips (integrated circuits: ICs) is intended to detect the bonding state of solder bonding the functional surfaces of semiconductor chips and wiring boards and fillers filling gaps between them. [0004] One such detection method is as follows: while the monocular ultrasonic transducer is mechanically scanned in water, ultrasonic waves are irradiated from the transducer throug...

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Problems solved by technology

[0005] This detection method has the following problems at the same time: the mechanical scanning immersed in water is laborious and time-consuming, and when detecting semiconductor chips, etc., the chips cannot be used after detection, and the connection terminal area of ​​the semiconductor chip to be detected is getting smaller and smaller, and the pitch It is getting narrower and narrower, and the abnormal judgment ability may be insufficient under the current detection accuracy

[0013] However, since the piezoelectric conversion element is immersed in liquid in the water immersion method, the liquid easily penetrates into the piezoelectric conversion element, reducing its durability.

And it is difficult to internally detect the object to be detected arranged in a closed container from the outside

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