Ultrasonic examining instrument

A detection device, ultrasonic technology, applied in measuring devices, using sound waves/ultrasonic waves/infrasonic waves to analyze solids, frequency/direction characteristic devices, etc., can solve problems such as unusable chips, narrow pitches, and easy intrusion

Inactive Publication Date: 2006-05-10
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This detection method has the following problems at the same time: the mechanical scanning immersed in water is laborious and time-consuming, and when detecting semiconductor chips, etc., the chips cannot be used after detection, and the connection terminal area of ​​the semiconductor chip to be detected is getting smaller and smaller, and the pitch It is getting narrower and narrower, and the

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0068] figure 1 It is a structural diagram explaining the structure of the ultrasonic detection apparatus concerning the 1st Example of this invention. Such as figure 1 As shown, the ultrasonic detection device includes: ultrasonic transducer 9; signal generating part 1; drive element selection part 2; signal detection circuit 4; amplifiers 5a, 5b, ..., 5i; , 6i; the signal processing unit 7, the display device 10, and the detection container 110. Water 15 is accommodated in the detection container 110, and the ultrasonic transducer 9, the semiconductor chip 11, the wiring substrate 13, and the connecting solder 12 (hereinafter referred to as the semiconductor chip) as the detection object (ultrasonic detection object) are arranged immersed in the water 15. 11. The wiring substrate 13 and the connecting solder 12 are collectively referred to as the semiconductor chip 11, etc.).

[0069] The ultrasonic transducer 9 is a device in which a plurality of piezoelectric conversion...

no. 2 Embodiment

[0083] image 3 It is a figure explaining the structure of the ultrasonic detection apparatus concerning the 2nd Example of this invention. exist image 3 In , components that have already been described are given the same numbers, and descriptions of the components and operations are omitted. This embodiment differs from the above-mentioned first embodiment in that the object to be detected is irradiated with ultrasonic waves not by water but by using a block material.

[0084] Such as image 3 As shown, the ultrasonic transducer 9 is constructed with a shoe material 16 as a substrate. Further, the block 16 is provided with a coupling medium 17 on its back surface, and the semiconductor chip 11 or the like to be detected is pressed by the coupling medium 17 . The bulk material 16 is made of the same material as that of the semiconductor chip 11 (for example, silicon, epoxy resin, ceramics, etc.). The coupling medium 17 may be of the material and thickness already describ...

no. 3 Embodiment

[0089] Figure 4 It is a configuration diagram illustrating the configuration of an ultrasonic testing device related to an embodiment of the present invention. exist Figure 4 In , the components already described are given the same numbers, and their structures and operations are omitted. In this embodiment, the piezoelectric conversion element is directly formed on the back surface (opposite to the functional surface) of the semiconductor chip 11a to be tested, and its upper electrode is contacted through the contact terminal to supply the driving voltage and take out the generated voltage.

[0090] Such as Figure 4 As shown, a common electrode 58 is formed on the back surface of the semiconductor chip 11a by, for example, sputtering, and piezoelectric layers 60a, 60b, 60c, 60d, . . . are formed in a matrix on the common electrode 58 . Upper electrodes 59a, 59b, 59c, 59d, . . . are formed on the piezoelectric layer 60a and the like. For example, the piezoelectric layer...

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Abstract

The invention provides an ultrasonic detection device capable of simple and convenient detection, high resolution and high speed processing. The ultrasonic detection device of the present invention has: a laser light source, which generates laser light intermittently or with modulated intensity; an optical irradiation system, which makes the generated laser light irradiate the detection object in a point shape; a scanning movement mechanism, which makes the optical irradiation system relatively detect The scanning movement of the object; the vibration displacement detecting section, which utilizes a displacement measurement method using laser light, non-contactly detects the vibration displacement of the surface of the detection object, and converts it into an electric signal, and the vibration displacement of the detection object surface is detected by the irradiated laser The generated echo of the ultrasonic wave in the detection object is caused; and the processing part, which performs visualization processing on the state of the detection object according to the converted electrical signal and the position of the scanning optical irradiation system.

Description

[0001] The present invention is a divisional application of Chinese Patent Application No. 02802634.9, which entered the national phase on April 10, 2003, entitled "ultrasonic detection device, ultrasonic transducer, detection device, and ultrasonic imaging device". technical field [0002] The present invention relates to an ultrasonic testing device that uses ultrasonic waves to detect internal defects and abnormalities such as peeling of semiconductor chips, metals, ceramic parts, resins, etc. Background technique [0003] Ultrasonic inspection of microscopic internal structures such as semiconductor chips (integrated circuits: ICs) is intended to detect the bonding state of solder bonding the functional surfaces of semiconductor chips and wiring boards and fillers filling gaps between them. [0004] One such detection method is as follows: while the monocular ultrasonic transducer is mechanically scanned in water, ultrasonic waves are irradiated from the transducer throug...

Claims

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Application Information

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IPC IPC(8): G01N29/06B06B1/06G01N29/00G01N29/04G01N29/24H04R1/34
Inventor 唐泽博一中本正幸落合诚福田胜义平泽泰治池田贤弘
Owner KK TOSHIBA
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