Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device

A detection device, ultrasonic technology, applied in the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, use sound waves/ultrasonic waves/infrasonic waves for material analysis, and measurement devices, etc. It can solve the problem of small connection terminals, internal detection of objects that are difficult to detect, and abnormalities Insufficient judgment ability, etc.

Inactive Publication Date: 2004-04-28
KK TOSHIBA
View PDF0 Cites 27 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] This detection method has the following problems at the same time: the mechanical scanning immersed in water is laborious and time-consuming, and when detecting semiconductor chips, etc., the chips cannot be used after detection, and the connection terminal area of ​​the semiconductor chip to be detected is getting smaller and smaller, and the pitch It is getting narrower and narrower, and the abnormal judgment ability may be insufficient under the current detection accuracy
[0012] However, since the piezoelectric conversion element is immersed in liquid in the water immersion method, the liquid easily penetrates into the piezoelectric conversion element, reducing its durability.
And it is difficult to internally detect the object to be detected arranged in a closed container from the outside

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device
  • Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device
  • Ultrasonic detector ultrasonic transducer, examining instrument and ultrosonograhping device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0086] figure 1 It is a structural diagram explaining the structure of the ultrasonic detection apparatus concerning the 1st Example of this invention. Such as figure 1 As shown, the ultrasonic detection device includes: ultrasonic transducer 9; signal generating part 1; drive element selection part 2; signal detection circuit 4; amplifiers 5a, 5b, ..., 5i; , 6i; the signal processing unit 7, the display device 10, and the detection container 110. Water 15 is accommodated in the detection container 110, and the ultrasonic transducer 9, the semiconductor chip 11, the wiring substrate 13, and the connecting solder 12 (hereinafter referred to as the semiconductor chip) as the detection object (ultrasonic irradiation object) are arranged immersed in the water 15. 11. The wiring substrate 13 and the connecting solder 12 are collectively referred to as the semiconductor chip 11, etc.).

[0087] The ultrasonic transducer 9 is a device in which a plurality of piezoelectric conversi...

no. 2 Embodiment

[0101] image 3 It is a figure explaining the structure of the ultrasonic detection apparatus concerning the 2nd Example of this invention. exist image 3 In , components that have already been described are given the same numbers, and descriptions of the components and operations are omitted. This embodiment differs from the above-mentioned first embodiment in that the object to be detected is irradiated with ultrasonic waves not by water but by using a block material.

[0102] Such as image 3 As shown, the ultrasonic transducer 9 is constructed with a shoe material 16 as a substrate. Further, the block 16 is provided with a coupling medium 17 on its back surface, and the semiconductor chip 11 or the like to be detected is pressed by the coupling medium 17 . The bulk material 16 is made of the same material as that of the semiconductor chip 11 (for example, silicon, epoxy resin, ceramics, etc.). The coupling medium 17 may be of the material and thickness already describ...

no. 3 Embodiment

[0107] Figure 4 It is a configuration diagram illustrating the configuration of an ultrasonic testing device related to an embodiment of the present invention. exist Figure 4 In , the components already described are given the same numbers, and their structures and operations are omitted. In this embodiment, the piezoelectric conversion part is directly formed on the back surface (opposite to the functional surface) of the semiconductor chip 11a to be tested, and its upper electrode is contacted through the contact terminal to supply the driving voltage and take out the generated voltage.

[0108] Such as Figure 4 As shown, a common electrode 58 is formed on the back surface of the semiconductor chip 11a by, for example, sputtering, and piezoelectric layers 60a, 60b, 60c, 60d, . . . are formed in a matrix on the common electrode 58 . Upper electrodes 59a, 59b, 59c, 59d, . . . are formed on the piezoelectric layer 60a and the like. For example, the piezoelectric layer 60...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

An ultrasonograph, an ultrasonic transducer, an inspection device, and an ultrasonic imaging device enabling easy and quick inspection and high-resolution or high-speed processing are provided. Barium titanate (BaTiO3) or lead zirconate titanate (PZT) is used for a piezoelectric material constituting the ultrasonic transducer, and the thickness thereof is 0.1 mum to 100 mum. Included therein are a drive section capable of driving an arbitrary one of piezoelectric layers, a detecting section detecting electrical signals generated by the plural piezoelectric layers based on echoes from an irradiation object, the echoes being originated from an ultrasonic wave generated by the driven piezoelectric layer, and a processing section performing processing for visualizing a state of the irradiation object based on the detected electrical signals.

Description

technical field [0001] The present invention relates to an ultrasonic testing device for detecting internal defects and peeling off of semiconductor chips, metal, ceramic parts, resin, etc. by using ultrasonic waves, and an ultrasonic transducer, a testing device, and an ultrasonic imaging device, and particularly relates to simple, convenient, more precise or more Ultrasonic testing devices, ultrasonic transducers, testing devices, and ultrasonic imaging devices for high-speed detection of abnormalities. Background technique [0002] Ultrasonic inspection of microscopic internal structures such as semiconductor chips (integrated circuits: ICs) is intended to detect the bonding state of solder bonding the functional surfaces of semiconductor chips and wiring boards and fillers filling gaps between them. [0003] One such detection method is as follows: while the monocular ultrasonic transducer is mechanically scanned in water, ultrasonic waves are irradiated from the transdu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B06B1/06G01N29/06G01N29/24G01N29/28G01S15/89H10N30/50
CPCG01N2291/0423G01N29/2418G01N29/28B06B1/0622G01N29/06G01N29/2437G01N2291/106G01N29/24
Inventor 唐泽博一中本正幸落合诚福田胜义平泽泰治池田贤弘
Owner KK TOSHIBA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com