Metal scavenger composition and method for producing the same
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A metal scavenger and composition technology, which is applied in the field of metal scavenger compositions of pure tin, tin-lead or tin-copper alloys, can solve the problems of slow tin stripping speed, reduced insulation resistance, low corrosion rate, etc., and achieves environmental pollution. Small, fast-clearing effects
Inactive Publication Date: 2009-09-09
珠海顺泽科技股份有限公司
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Abstract
Description
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Problems solved by technology
[0005] The above-mentioned products have low tin, tin-lead and tin-copper dissolution amounts, and are easy to corrode the substrate and copper surface during use, oxidize the copper surface, reduce insulation resistance, and affect the quality of printed circuit boards. The speed of tin is slow, and the waste liquid generated is not easy to handle and has low recovery value, which is easy to cause environmental pollution
Method used
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[0038] 16.1 kg of ferric nitrate, 0.4 kg of urea, 0.4 kg of benzotriazole, 0.3 kg of methyl benzotriazole, 1.6 kg of hydrochloric acid, 35 kg of nitric acid, and 46.2 kg of water.
Embodiment 3
[0040] 16.3 kg of ferric nitrate, 0.4 kg of urea, 0.4 kg of benzotriazole, 0.3 kg of methyl benzotriazole, 1.7 kg of hydrochloric acid, 36 kg of nitric acid, and 44.9 kg of water.
[0041] Three. the preparation method of described metal scavenger composition:
[0042] at normal temperature and pressure
[0043] 1. Add raw materials such as nitric acid, ferric nitrate, hydrochloric acid, urea, benzotriazole, tolyltriazole and water in the production tank in sequence;
[0044] 2. Test after stirring until completely dissolved.
[0045] Four. the product specification of described metal scavenger composition:
[0046] Appearance: Yellow easy flowing liquid
[0047] Specific gravity (25°C): 1.26+ / -0.02
[0048] Acid equivalent: >6.5N
[0049] Five. the mode of operation of the metal scavenger composition in production:
[0050] Spraying method, and can be added by discharge or automatically.
[0051] Mixing tank: the raw liquid of the cylinder opening liquid is directly mi...
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Abstract
The invention discloses a metal scavenger composition for removing pure tin, tin-lead or tin-copper alloy on the copper surface of a printed circuit board and a production method thereof. It consists of the following components by weight percentage: 15.9% to 16.3% of ferric nitrate, 0.3% to 0.4% of urea, 0.3% to 0.4% of benzotriazole, 0.2% to 0.3% of methyl benzotriazole, hydrochloric acid 1.5%~1.7%, nitric acid 33%~36%, and the rest is water. The method for producing the metal scavenger composition comprises: (1) adding raw materials nitric acid, ferric nitrate, hydrochloric acid, urea, benzotriazole, tolyltriazole and water in proportion in the production tank successively, ( 2) Test after stirring until completely dissolved. The metal scavenger composition is a single-component type, which can maintain a very low corrosion rate for copper while achieving high corrosion of impurities on the copper surface. Small pollution, wide applicability and convenient operation.
Description
technical field [0001] The invention relates to a chemical metal scavenger, more precisely to a metal scavenger composition used in the production process of a printed circuit board to remove pure tin, tin-lead or tin-copper alloy formed on the surface of a substrate and a production method thereof. Background technique [0002] A general printed circuit board has a copper conductor pattern on an insulating base plate, and tin or solder is usually coated on the copper substrate by electroplating to form a tin or tin-lead alloy film coating. At present, impurities such as tin, tin-lead or tin-copper alloy and solder on the copper surface need to be removed after etching in the production of PCB negatives. The scavenger solutions commonly used in the industry in the past generally use two types of compositions. The most widely used in the past The composition used is based on an acidic solution containing fluorine peroxide and a fluoride. In recent years, the industry has cha...
Claims
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Application Information
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