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Metal scavenger composition and method for producing the same
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A technology of metal scavenger and composition, which is applied in the field of metal scavenger composition of pure tin, tin-lead or tin-copper alloy, can solve problems such as slow tin stripping speed, lower insulation resistance, and affect the quality of printed circuit boards, and achieve The effect of less environmental pollution and quick removal
Inactive Publication Date: 2008-03-12
珠海顺泽科技股份有限公司
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Abstract
Description
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Problems solved by technology
[0005] The above-mentioned products have low tin, tin-lead and tin-copper dissolution amounts, and are easy to corrode the substrate and copper surface during use, oxidize the copper surface, reduce insulation resistance, and affect the quality of printed circuit boards. The speed of tin is slow, and the waste liquid generated is not easy to handle and has low recovery value, which is easy to cause environmental pollution
Method used
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[0038] 16.1 kg of ferric nitrate, 0.4 kg of urea, 0.4 kg of benzotriazole, 0.3 kg of methyl benzotriazole, 1.6 kg of hydrochloric acid, 35 kg of nitric acid, and 46.2 kg of water.
Embodiment 3
[0040] 16.3 kg of ferric nitrate, 0.4 kg of urea, 0.4 kg of benzotriazole, 0.3 kg of methyl benzotriazole, 1.7 kg of hydrochloric acid, 36 kg of nitric acid, and 44.9 kg of water.
[0041] Three. the preparation method of described metal scavenger composition:
[0043] 1. Add raw materials such as nitric acid, ferric nitrate, hydrochloric acid, urea, benzotriazole, tolyltriazole and water in the production tank in sequence;
[0044] 2. Test after stirring until completely dissolved.
[0045] Four. the product specification of described metal scavenger composition:
[0049] Five. the mode of operation of the metal scavenger composition in production:
[0050] Spraying method, and can be added by discharge or automatically.
[0051] Mixing tank: the raw liquid of the cylinder opening liquid is directly mi...
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Abstract
The invention discloses a metal-removing agent combination for removing pure tin, tin-lead or tin-copperalloy on printed circuit boards and a production method for the metal-removing agent combination, which comprises by weight the following components: iron nitrate 15.9-16.3%, urea 0.3-0.4%, benzotriazole 0.3-0.4%, methyl benzotriazole 0.2-0.3%, hydrochloric acid 1.5-1.7%, nitric acid 33-36%, and the remainder water. The method for producing the removing agent combination comprises such procedures as (1) adding in sequence according to proportion the raw materials nitric acid, iron nitrate, hydrochloric acid, urea, benzotriazole, methyl benzotriazole and water in a production tank; (2) agitating till the raw materials solve completely, and inspecting. The metal-removing agent combination is a standalone fluid, can erode rapidly any foreign matters on a copper surface while maintaining a very low eroding rate to the copper, contains no fluoride and will not erode the base material, has a high removing speed, low environmental pollution, and is of a wide applicability and operation convenience.
Description
technical field [0001] The invention relates to a chemical metal scavenger, more precisely to a metal scavenger composition used in the production process of a printed circuit board to remove pure tin, tin-lead or tin-copper alloy formed on the surface of a substrate and a production method thereof. Background technique [0002] A general printed circuit board has a copper conductor pattern on an insulating base plate, and tin or solder is usually coated on the copper substrate by electroplating to form a tin or tin-lead alloyfilm coating. At present, impurities such as tin, tin-lead or tin-copper alloy and solder on the copper surface need to be removed after etching in the production of PCB negatives. The scavenger solutions commonly used in the industry in the past generally use two types of compositions. The most widely used in the past The composition used is based on an acidic solution containing fluorineperoxide and a fluoride. In recent years, the industry has cha...
Claims
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Application Information
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