Heat-curing type one-pack resin composition

A resin composition and heat curing technology, applied in the field of one-component resin composition, can solve the problems such as low-temperature fast curing and storage stability that are not specifically recorded, and achieve good storage stability, low-temperature fast curing, and The effect of high adhesion

Inactive Publication Date: 2012-06-27
THREEBOND FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In Japanese Patent No. 3253919, Japanese Patent No. 3540926, and Japanese Patent Application Laid-Open No. 2001-342253, it is described that a heat-curable one-component resin composition using an episulfide resin can be formed by using a latent curing agent, but there is no Specific examples of how to use which curing agent to obtain good low-temperature fast curing and storage stability

Method used

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  • Heat-curing type one-pack resin composition
  • Heat-curing type one-pack resin composition
  • Heat-curing type one-pack resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～32 and comparative example 1～4

[0115] Materials were mixed and stirred at the weight ratios shown in the following tables (Tables 1 to 4) to obtain samples (compositions) of Examples 1 to 32 and Comparative Examples 1 to 4, and evaluation studies were performed.

[0116] The evaluation results are also shown in Tables 1 to 4.

[0117] Table 1

[0118]

[0119] As can be seen from Example 1, the curing time at 80°C can be obtained by adding a thiol compound and a heat-latent curing accelerator to a resin component having an oxirane ring / ethiol ring ratio of 100. It is a composition that is 30 minutes or less, has storage stability of 7 days or more at 40° C., and is excellent in low-temperature rapid curing and storage stability.

[0120] From Examples 2 to 4, it can be seen that by adding an acidic compound, boric acid The ester provides a composition excellent in storage stability while maintaining low-temperature rapid curing properties.

[0121] As can be seen from Comparative Examples 1 and 2, wh...

Embodiment 33～40 and comparative example 5～12

[0139] The materials were mixed and stirred at the weight ratio shown in the following table (Table 5) to obtain each sample (composition) of Examples 33-40 and Comparative Examples 5-12, and each obtained sample (composition) was evaluated. The results are summarized in Table 5.

[0140]

[0141]

[0142] In Examples 33 to 38, a thiol compound was blended in the resin component (1) in which the ratio of the number of oxirane rings to thieme rings was in the range of 40 / 60 to 10 / 90. , thermal latent curing accelerator, core-shell type acrylic rubber particles, acidic compound, obtained high shear bonding strength above 15MPa, curing time at 80°C within 15 minutes, and 3 months at -20°C The above storage stability, no separation of uncured resin composition.

[0143] In Examples 39 and 40, it can be seen that when the mixture of the resin component (1) has a thiolane ring content of less than 60, rapid curing within 15 minutes at 80° C. cannot be achieved. In Examples 4...

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Abstract

A thermosetting one-component resin composition comprising: (1) a compound, or mixture of compound, containing at least one of a compound having two or more thiirane rings in each molecule thereof (A), a compound having both of a thiirane ring and an oxirane ring in each molecule thereof (B) and a compound having one or more oxirane rings and containing no thiirane ring in each molecule thereof (C), wherein the ratio of oxirane rings / thiirane rings contained is in the range of 40 / 60 to 10 / 90; (2) a thiol compound having one or more thiol group in each molecule thereof; and (3) a heat-latent curing accelerator; optionally together with (4) an acid compound and / or a boric acid ester; and (5) core / shell type acrylic rubber microparticles. This composition can be used in various usages, such as bonding, sealing, casting, molding, painting, coating, etc., excelling in low-temperature rapid curability as compared with that of conventional episulfide thermosetting one-component resin composition, and has excellent storage stability.

Description

technical field [0001] The present invention relates to a one-component resin composition which is excellent in rapid curability by heating at a low temperature and has good storage stability (storage stability). Background technique [0002] As an episulfide resin, a compound having an oxirane ring in which all or a part of oxygen atoms of an oxirane ring of an epoxy resin is substituted with a sulfur atom is known. Episulfide resins are known to have characteristics such as excellent low-temperature curability with amine compounds, good water resistance, high refractive index, and flame retardancy, compared with epoxy resins. However, most of the existing episulfide-based compositions are of the two-component type. Before actual use, complicated processes such as metering, mixing, and defoaming of the resin component and the curing agent component are required, and the usable time after mixing It is limited, and there is also the possibility of mixing failure, so there ar...

Claims

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Application Information

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IPC IPC(8): C08G75/08C08L81/02
CPCC08G59/66C08L81/02C08G75/04C08L63/00C08G75/08C08L2666/24
Inventor桐野学高山真树井上学
OwnerTHREEBOND FINE CHEM CO LTD