This invention discloses a dendritic
hybrid branched
polymer copper bonding agent and its preparation method, belonging to the field of
printed circuit board surface treatment technology. The
active ingredient of this bonding agent is a three-dimensional dendritic
polymer formed by
grafting hybrid branches containing
benzimidazole,
triazole, and
thiol groups onto a branched polyethyleneimine backbone through molecular design. Its
aqueous solution contains 0.1%–5.0% of the
polymer, 0.5%–10.0% of
carboxylic acid, 0.01%–1.0% of surfactant, and the
balance water. The preparation method includes polymer synthesis and the preparation of its
aqueous solution. The synthesis process involves steps such as amine activation, functional group
grafting, and
thiol deprotection. This invention achieves ultra-
high adhesion between the
copper surface and dry film, wet film, or solder
resist ink without completely corroding the
copper surface, through the synergistic effect of multiple functional groups and the high-density bonding sites of the dendritic structure. Simultaneously, it perfectly maintains the smoothness of the copper surface, significantly reduces high-frequency
signal transmission loss, and has the advantages of being
environmentally friendly and having good process compatibility, making it particularly suitable for the manufacture of high-frequency, high-speed PCBs.