The invention discloses a single-component
epoxy heat-conducting
adhesive which consists of the following components in percentage by weight: 20 to 60 percent of
epoxy resin, 5 to 15 percent of
diluent, 5 to 25 percent of curing agent and 20 to 50 percent of heat-conducting filler, wherein the heat-conducting filler is prepared by performing surface treatment in the following method: adding the heat-conducting filler,
organic acid and a
coupling agent into
solvent and uniformly dispersing,
drying until the
solvent is completely volatilized, and collecting the obtained
powder for later use, thereby finishing the whole treatment process; and the raw materials comprise the following components in percentage by weight: 10 to 20 percent of heat-conducting filler, 0.5 to 5 percent of
organic acid, 0.2 to 2 percent of
coupling agent, and the balance of
solvent. The heat-conducting filler is subjected to surface treatment, the
epoxy resin serves as a matrix, the highly heat-conducting
adhesive is prepared and has high preservation stability, and the usage amount of the heat-conducting filler is reduced; and moreover, the solvent is recycled in the production process, and the environmental
pollution is slight, so that the single-component epoxy heat-conducting
adhesive has the advantages of convenience in use, excellent performance and low cost, and the requirements of heat-conducting
package and adhesion in the fields of
electronics and electrics and the like are well met.